Photosensitive insulating resin composition, cured product thereof and electronic component comprising the same
The objective of the present invention is to provide a photosensitive insulating resin composition which is highly sensitive to g-line and h-line and enables to form a surface-protecting film, an interlayer insulation film and a planarized film that are excellent in various properties including resolution, electrical insulation property and thermal shock resistance, a cured product and an electronic component having the cured product. The present photosensitive insulating resin composition comprises an alkali-soluble resin having a phenolic hydroxyl group, a radiation sensitive acid generator comprising an s-triazine derivative represented by the following general formula (1), and a crosslinking agent. [In the formula (1), R is hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxyl group having 1 to 4 carbon atoms, X is a halogen atom and Y is oxygen atom or sulfur atom.]
1. A photosensitive insulating resin composition, comprising
[A] an alkali-soluble resin having a phenolic hydroxyl group,
[B] a radiation sensitive acid generator comprising an s-triazine derivative represented by the following general formula (1), and
[C] a crosslinking agent,
wherein said crosslinking agent [C] comprises a novolak type epoxy resin and an alkyl-etherified melamine, and
wherein, in the formula (1),
R is hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxyl group having 1 to 4 carbon atoms,
X is a halogen atom, and
Y is oxygen atom or sulfur atom.
2. The photosensitive insulating resin composition according to claim 1 , wherein a content of said novolak type epoxy resin is 50% by weight or less based on 100% by weight of a total of said novolak type epoxy resin and said alkyl-etherified melamine.
3. The photosensitive insulating resin composition according to claim 1 , further comprising [D] a crosslinked fine particle.
4. A cured product wherein said photosensitive insulating resin composition according to claim 1 is cured.
5. An electronic component comprising said cured product according to claim 4 .
6. The electronic component according to claim 5 , wherein said cured product is an interlayer insulation film or a planarized film.
7. A photosensitive insulating resin composition, comprising
[A] an alkali-soluble resin having a phenolic hydroxyl group,
[B] a radiation sensitive acid generator comprising an s-triazine derivative represented by the following general formula (1), and
[C] a crosslinking agent,
wherein said crosslinking agent [C] comprises trimethyloipropane polyglycidyl ether and an alkyl-etherified melamine, and
wherein, in the formula (1),
R is hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an alkoxyl group having 1 to 4 carbon atoms,
X is a halogen atom, and
Y is oxygen atom or sulfur atom.
8. The photosensitive insulating resin composition according to claim 7 , wherein a content of said trimethylolpropane polyglycidyl ether is 50% by weight or less based on 100% by weight of a total of said trimethylolpropane polyglycidyl ether and said alkyl-etherified melamine.
9. The photosensitive insulating resin composition according to claim 7 , further comprising [D] a crosslinked fine particle.
10. A cured product wherein said photosensitive insulating resin composition according to claim 7 is cured.
11. An electronic component comprising said cured product according to claim 10 .
12. The electronic component according to claim 11 , wherein said cured product is an interlayer insulation film or a planarized film.