Carrier tray for use with prober
View Patent ↗A carrier tray for use with a prober is arranged to allow the prober to measure or test not only semiconductor wafers but also semiconductor packages and accurately position each of different-shaped semiconductor packages. A carrier tray 1 includes a lowermost tray 10 and an uppermost tray 20 interposing therebetween an intermediate tray 30 . The lowermost and uppermost trays 10 and 20 are each of a circular shape having a diameter D 1 . A diameter D 3 of the intermediate tray 30 is smaller than the diameter D 1 . The intermediate tray 30 is centrally formed with a screw hole portion 32 in which a locking spacer screw 22 is screwed. A semiconductor package 40 is to be placed in a package holding pocket 11 . With the locking spacer screw 22 , the intermediate 30 is slidable in an X and Y directions, so that the X and Y coordinates of the semiconductor package 40 are determined uniquely relative to the carrier tray 1.
1. A carrier tray for a semiconductor package, which is used in a test of the semiconductor package by a prober for testing a semiconductor wafer, the carrier tray comprising:
a first tray provided with a plurality of rectangular holding parts arranged in a matrix, each of which has a depth smaller than thickness of the semiconductor package and is configured to hold the semiconductor package; and
a second tray provided with a plurality of first windows arranged in correspondence with the plurality of rectangular holding parts, each first window being of a rectangular shape to surround each semiconductor package, and the second tray being placed in contact with the first tray;
wherein the first and second trays are slidable relative to each other, one of the first and second trays is of an outer diameter equals to an outer diameter of the semiconductor wafer to be handled by the prober and an outer edge of the other tray stays within a range corresponding to an outer edge of one of the first and second trays during sliding.
2. The carrier tray according to claim 1 further comprising a third tray provided with a plurality of second windows arranged in correspondence with the plurality of rectangular holding parts, wherein the third tray having an outer diameter equals to the semiconductor wafer and being placed on the second tray above the second tray.
3. The carrier tray according to claim 1 , wherein the one of the first and second trays having the outer diameter equals to the outer diameter of the semiconductor wafer is provided with a notch or an orientation flat that is identical to a notch or an orientation flat of the semiconductor wafer.
4. The carrier tray according to claim 2 , wherein the third tray is provided with either one of an alignment mark identical to an alignment mark of the semiconductor wafer and a specific alignment mark to the carrier tray.
5. The carrier tray according to claim 4 , wherein the alignment mark includes a plurality of marks at least one of which is of a columnar shape having a predetermined height in a vertically upward direction from the tray.
6. The carrier tray according to claim 2 , wherein the third tray is provided with a scribe line identical to a scribe line of the semiconductor wafer, the scribe line being arranged around each second window.
7. The carrier tray according to claim 6 , wherein the third tray is of a circular shape, and the scribe line is formed to divide the second window in index size with reference to the center of the third tray.
8. The carrier tray according to claim 2 , wherein
the second tray is provided thereon with at least one protruding portion that extends vertically upward, and
the third tray is provided with a slide hole to correspond to the protruding portion so that the protruding portion protrudes through the slide hole, and
the second tray is slidable in a range that the protruding portion stays within an inner edge of the slide hole.