Package mounted module and package board module
A package board module wherein a semiconductor chip such as an LSI is mounted on the topside surface of a package board, and a package mounted module wherein the package board is mounted on the motherboard of a large-sized computer or the like. A stiffener for supporting the package board and/or a stiffener for supporting the motherboard each has a bimetal structure wherein a first member and a second member having mutually different thermal expansion coefficients are respectively adhered to each other, so as to cause the stiffeners to warp in harmony with the warpage of the package board and the motherboard caused by a temperature change, thereby preventing stress from arising in the solder-bonded portions.
1. A package mounted module comprising:
a package board on a topside surface of which a semiconductor chip is mounted;
a motherboard onto a topside surface of which an underside surface of the package board is solder-bonded; and
a first stiffener disposed on an underside surface of the motherboard in a position to interpose the motherboard between the first stiffener and the package board and fixed to the motherboard with fastening components, wherein
the first stiffener has one layer that is farther from the motherboard than an other layer thereof in contact with the underside surface of the motherboard and that has a thermal expansion coefficient larger than that of the other layer,
the first stiffener has an area larger than an area of the package board and is fixed to the motherboard, at a plurality of positions with the fastening components, in a region excluding a portion where the first stiffener overlaps the motherboard and outside the package board when the package board, the motherboard and the first stiffener are stacked and viewed, and
the first stiffener has a bimetal structure formed of a first member that is the other layer in contact with the underside surface of the motherboard and a second member that is the one layer directly in contact with one surface of the first member farther from the motherboard than the other surface thereof and having a thermal expansion coefficient larger than that of the first member.
2. The package mounted module according to claim 1 , wherein the fastening components are screws.
3. The package mounted module according to claim 1 , wherein the package board is solder-bonded to the topside surface of the motherboard by fusion and fixation of solder balls arranged on the underside surface of the package board.
4. The package mounted module according to claim 1 , further comprising a second stiffener fixed in contact with the topside surface of the package board so as to surround the semiconductor chip mounted on the topside surface of the package board, wherein the second stiffener has one layer that is farther from the package board than the other layer thereof in contact with the topside surface of the package board and that has a thermal expansion coefficient smaller than that of the other layer.
5. The package mounted module according to claim 4 , wherein the second stiffener has a bimetal structure formed of a first member that is the other layer in contact with the topside surface of the package board and a second member that is the one layer in contact with one surface of the first member farther from the package board than the other surface thereof and having a thermal expansion coefficient smaller than that of the first member.