IP Library Patent Application 11839044
Patent Application
App. No. 11/839,044

METHODS AND APPARATUS FOR A SYNTHETIC ANTI-FERROMAGNET STRUCTURE WITH IMPROVED THERMAL STABILITY

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Patent No.
US None
App. No.
11/839,044
Abstract

A synthetic antiferromagnet (SAF) structure includes a bottom ferromagnetic layer, a coupling layer formed over the bottom ferromagnetic layer, and a top ferromagnetic layer formed over the coupling layer. One of the top and bottom ferromagnetic layers comprises an amorphous alloy characterized by (Co 100-a Fe a ) 100-z B z , where a is less than approximately 10 atomic percent, and z is greater than approximately 20 atomic percent. In general, a magnetic device includes at least one magnetic layer comprising an amorphous CoFeB alloy characterized by (Co 100-a Fe a ) 100-z B z , where a is less than approximately 10 atomic percent, and z is greater than approximately 20 atomic percent.

Claims (34)

1 . A synthetic anti-ferromagnet (SAF) structure comprising:

a bottom ferromagnetic layer;

a coupling layer formed over the bottom ferromagnetic layer; and

a top ferromagnetic layer formed over the coupling layer;

wherein at least one of the top and bottom ferromagnetic layers comprises an amorphous CoFeB alloy characterized by (Co 100-a Fe a ) 100-z B z , where a is less than approximately 10 atomic percent, and z is greater than approximately 20 atomic percent.

2 . The SAF structure of claim 1 , wherein z is between approximately 23 and 30 atomic percent.

3 . The SAF structure of claim 1 , wherein the SAF structure is configured to provide a uniaxial anisotropy such that the kink field H k of the bottom and top ferromagnetic layers is less than approximately 16 Oe.

4 . The SAF structure of claim 1 , wherein the bottom and top ferromagnetic layers exhibit a magnetostriction λ, where λ is in the range of −1×10 −6 <λ<1×10 −6 .

5 . The structure of claim 1 , wherein the bottom ferromagnetic layer has a thickness greater than approximately 20 Å, and the second ferromagnetic layer has a thickness greater than approximately 20 Å.

6 . The structure of claim 1 , wherein the coupling layer is ruthenium.

7 . A magnetic tunnel junction (MTJ) structure comprising:

a first electrode;

a pinned synthetic anti-ferromagnet (SAF) formed over the first electrode;

a free-layer SAF formed over the pinned SAF;

a dielectric layer formed between the free-layer SAF and the pinned SAF;

a top electrode formed over the free-layer SAF;

wherein the free-layer SAF comprises a bottom ferromagnetic layer, a coupling layer formed over the bottom ferromagnetic layer, and a top ferromagnetic layer formed over the coupling layer, wherein at least one of the top and bottom ferromagnetic layers comprises an amorphous CoFeB alloy characterized by (Co 100-a Fe a ) 100-z B z , where a is less than approximately 10 atomic percent, and z is greater than approximately 20 atomic percent.

8 . The MTJ structure of claim 7 , wherein z is between approximately 23 and 30 atomic percent.

9 . The MTJ structure of claim 7 , wherein the free-layer SAF is configured to provide a uniaxial anisotropy such that a kink field H k of the top and bottom ferromagnetic layers is less than approximately 16 Oe.

10 . The MTJ structure of claim 7 , wherein the bottom and top ferromagnetic layers exhibit a magnetostriction λ, where λ is in the rang of −1×10 −6 <λ<1×10 −6 .

11 . The MTJ structure of claim 7 , wherein the bottom ferromagnetic layer has a thickness greater than approximately 20 Å, and the second ferromagnetic layer has a thickness greater than approximately 20 Å.

12 . The MTJ structure of claim 7 , wherein the coupling layer is ruthenium.

13 . A method of fabricating a synthetic antiferromagnet (SAF) comprising:

forming a bottom ferromagnetic layer;

forming a coupling layer over the bottom ferromagnetic layer; and

forming a top ferromagnetic layer over the coupling layer;

wherein forming the top and bottom ferromagnetic layers includes forming an amorphous CoFeB alloy characterized by (Co 100-a Fe a ) 100-z B z , where a is less than approximately 10 atomic percent, and z is greater than approximately 20 atomic percent.

14 . The method of claim 13 , wherein z is between approximately 23 and 30 atomic percent.

15 . The method of claim 13 , wherein the SAF structure is configured to provide a uniaxial anisotropy such that a kink field H k of the bottom and top ferromagnetic layers is less than approximately 16 Oe.

16 . The method of claim 13 , wherein the ferromagnetic layers exhibit a magnetostriction λ, where λ is in the rang of −1×10 −6 <λ<1×10 −6 .

17 . The method of claim 13 , wherein forming the bottom ferromagnetic layer includes forming a layer having a thickness greater than approximately 20 Å, and forming the top ferromagnetic layer includes forming a layer having a thickness greater than approximately 20 Å.

18 . The method of claim 13 , wherein forming the bottom and top ferromagnetic layers includes co-sputtering films at least two different targets.

19 . The method of claim 13 , wherein forming the bottom and top ferromagnetic layers includes multilayering films using sputtering deposition.

20 . A magnetic device with at least one magnetic layer comprising an amorphous CoFeB alloy characterized by (Co 100-a Fe a ) 100-z B z , where a is less than approximately 10 atomic percent, and z is greater than approximately 20 atomic percent.

Assignments (15)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0704 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2010
From: CITIBANK, N.A.
To: EVERSPIN TECHNOLOGIES, INC.
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ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2009
From: FREESCALE SEMICONDUCTOR, INC.
To: EVERSPIN TECHNOLOGIES, INC.
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SECURITY AGREEMENT Recorded Feb 16, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 020518/0215 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 27, 2007
From: SUN, JIJUN; DAVE, RENU W.; SLAUGHTER, JON M.
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 019746/0936 →