Semiconductor device and method for fabricating the same
View Patent ↗A semiconductor device with a structure having superior heat sink characteristics. A first heat sink member is located over a wiring board by using an adhesive material. A semiconductor element is stuck over the first heat sink member by using an adhesive material. The semiconductor element and electrodes located over the wiring board are connected by wires. A second heat sink member which covers the semiconductor element and the wires is joined to the first heat sink member by using a conductive adhesive material. The inside and outside of the second heat sink member are sealed by resin except a flat top thereof. By doing so, the semiconductor device is fabricated. Heat which is generated in the semiconductor element and which is transmitted to the first heat sink member is released from an edge portion of the first heat sink member. In addition, the heat which is generated in the semiconductor element and which is transmitted to the first heat sink member is transmitted to the conductive adhesive material and the second heat sink member and is released from the flat top of the second heat sink member.
1. A semiconductor device comprising:
a board having an electrode;
a first heat sink member located over the board;
a semiconductor element located over the first heat sink member;
a second heat sink member which covers the semiconductor element and which is thermally connected to the first heat sink member; and
an insulating member located between the semiconductor element and the second heat sink member, wherein:
the first heat sink member is configured with an opening in an area corresponding to the electrode of the board;
the semiconductor element is electrically connected to the electrode through the opening by a bonding wire; and
the insulating member seals the semiconductor element.
2. The semiconductor device according to claim 1 , wherein the board is configured with a heat sink heat release hole in an area over which the semiconductor element is mounted.
3. The semiconductor device according to claim 1 , wherein the board and the first heat sink member are configured with corresponding holes in areas over which the semiconductor element is mounted.
4. The semiconductor device according to claim 1 , wherein the second heat sink member is configured with a heat release hole.
5. The semiconductor device according to claim 1 , wherein the second heat sink member except part thereof is sealed by resin.
6. The semiconductor device according to claim 1 , wherein the first heat sink member and the second heat sink member are joined together with a conductive adhesive material therebetween.
7. The semiconductor device according to claim 1 , wherein the first heat sink member and the second heat sink member are welded together.
8. The semiconductor device according to claim 5 , wherein part of a junction of the first heat sink member and the second heat sink member is not covered with the resin and is exposed.
9. The semiconductor device according to claim 1 , wherein an area of the first heat sink member over which the semiconductor element is located is depressed.
10. The semiconductor device according to claim 1 , wherein thickness of the first heat sink member is the same as thickness of the second heat sink member.
11. The semiconductor device according to claim 3 , wherein a conductive adhesive material is located over the heat sink heat release hole between the board and the first heat sink member.