Method of embedding passive component within via
View Patent ↗A method of forming a device associated with a via includes forming an opening or via, and forming at least a pair of conducting paths within the via. Also disclosed is a via having at pair of conducting paths therein.
1. A substrate comprising:
a first conductive layer;
a second conductive layer substantially electrically isolated from the first conductive layer by a dielectric material;
a via for connecting a portion of the first conductive layer to a portion of the second conductive layer, the via having a first side and a second side, the dielectric material being between the first side and the second side, wherein the via further comprises:
a first plate located on the first side of the via, wherein none of a material of the first plate is located on the second side of the via, a first electrical path from the first conductive layer to the first plate; and
a second plate located on the second side of the via, wherein none of a material of the second plate is located on the first side of the via, a second electrical path from the second conductive layer to the second plate.
2. The substrate of claim 1 wherein the first plate and the second plate form a capacitor.
3. The substrate of claim 2 wherein the first plate and the second plate are separated by the dielectric material.
4. The substrate of claim 1 wherein the first plate includes a curved surface.
5. The substrate of claim 4 wherein the second plate includes a curved surface.
6. The substrate of claim 5 wherein the first plate and the second plate form a capacitor.
7. The substrate of claim 5 wherein the curve of the first plate and the curve of the second plate are substantially coaxial.
8. The substrate of claim 5 wherein a concave portion of the first plate faces a concave portion of the second plate.
9. A substrate comprising:
a first conductive layer;
a second conductive layer substantially electrically isolated from the first conductive layer by a dielectric material;
a via for connecting a portion of the first conductive layer to a portion of the second conductive layer, the via having a first side and a second side, the dielectric material being between the first side and the second side, wherein the via further comprises:
a first portion located on the first side of the via, wherein none of a material of the first portion is located on the second side of the via, a first electrical path from the first conductive layer to the first portion; and
a second portion located on the second side of the via, wherein none of a material of the second portion is located on the first side of the via, a second electrical path from the second conductive layer to the second portion.
10. The substrate of claim 9 wherein the second portion includes a substantially cylindrical shell of conductive material enclosed within the via.
11. The substrate of claim 9 wherein the first portion and the second portion are separated by the dielectric material.