Thermal head having bent electrode structure and method of manufacturing the same
A thermal head having electrode wiring lines in a narrow wiring region, in which a line and a space are narrow, with good pattern accuracy and a method of manufacturing the same are provided. A thermal head includes: a plurality of heating resistors arranged in a line at predetermined pitches there between on a protruding level difference part of a glazed substrate; bent wiring lines each of which serves to electrically connect a pair of adjacent heating resistors to each other; a common wiring line and individual wiring lines used to cause the pair of adjacent heating resistors to be electrically conducted through each of the bent wiring lines; and bonding pads formed on one ends of the individual wiring lines. The common wiring line has a narrow wiring region located between the bonding pads arranged in a line and a wide wiring region wider than the narrow wiring region. The wide wiring region is formed using a conductor layer and a resistor layer made of the same material as the heating resistors, and the narrow wiring region is formed using only the conductor layer without the resistor layer.
1. A thermal head comprising:
a glazed substrate having a protruding level difference part;
a plurality of heating resistors arranged in a line at predetermined pitches there between on the protruding level difference part; and
electrode wiring lines used to cause the plurality of heating resistors to electrically conduct,
wherein each of the electrode wiring lines has a wide wiring region and a narrow wiring region,
the wide wiring region is formed using a conductor layer and a resistor layer made of the same material as the heating resistors, and
the narrow wiring region is formed using only the conductor layer without the resistor layer.
2. The thermal head according to claim 1 ,
wherein an insulating barrier layer comprised of an insulating material is disposed on surfaces of the plurality of heating resistors.
3. A thermal head comprising:
a glazed substrate having a protruding level difference part;
a plurality of heating resistors arranged in a line at predetermined pitches there between on the protruding level difference part;
bent wiring lines each of which serves to electrically connect a pair of adjacent heating resistors to each other;
a common wiring line and individual wiring lines used to cause the pair of adjacent heating resistors to electrically conduct through each of the bent wiring lines; and
bonding pads used for connection of a driver IC, the bonding pads being formed on one ends of the individual wiring lines,
wherein the common wiring line has a narrow wiring region located between the bonding pads arranged in a line and a wide wiring region wider than the narrow wiring region,
the wide wiring region is formed using a conductor layer and a resistor layer made of the same material as the heating resistors, and
the narrow wiring region is formed using only the conductor layer without the resistor layer.
4. The thermal head according to claim 3 ,
wherein a sealing resin layer is provided, the sealing layer covering a bonding portion, which includes at least the narrow wiring region of the common wiring line, the bonding pads, and driver ICs wire-bonded to the bonding pads.