Electroplating cell and tool

1. An electroplating cell, comprising:

a cover configured to substantially seal said electroplating cell with an electrolyte containable therein to an outside atmosphere during an electroplating process;

a porous tube couplable to an inert gas source configured to bubble an inert gas through said electrolyte containable therein;

an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, said electrolyte being configured to enter said semipermeable membrane via a tube through a wall of said semipermeable membrane and coupled to a microporous filter;

a rotating magnet within said electroplating cell and configured to orient an axis of magnetization of said electroplating material for application to a wafer mounted thereon during said electroplating process;

a pH-sensing electrode configured to cooperate with a metering pump control assembly, coupled to an acid/base source, to maintain a particular pH level of said electrolyte containable in said electroplating cell; and

a partition configured to control a height of said electrolyte containable therein.

2. The electroplating cell as recited in claim 1 further comprising a partition configured to control a circulating pump configured to recirculate said electrolyte through said microporous filter.

3. The electroplating cell as recited in claim 1 wherein excess electrolyte containable therein is configured to flow behind a wall in said electroplating cell.

4. The electroplating cell as recited in claim 1 wherein said inert gas comprises nitrogen.

5. The electroplating cell as recited in claim 1 wherein said electrolyte containable in said electroplating cell has a dissolved-oxygen level less than 10 parts per billion.

6. The electroplating cell as recited in claim 1 wherein said alloy is formed from cobalt and iron.

7. The electroplating cell as recited in claim 1 wherein said alloy is formed from cobalt at about four atomic percent and iron at about 96 atomic percent.

8. The electroplating cell as recited in claim 1 wherein said magnet comprises a current-carrying coil.

9. The electroplating cell as recited in claim 1 wherein said pH-sensing electrode is within said electroplating cell.

10. The electroplating cell as recited in claim 1 further comprising nozzles therein configured to cooperate with a circulating pump via another tube to maintain a flow rate for said electrolyte containable in said electroplating cell.

11. An electroplating tool, comprising:

a reservoir, including:

a cover configured to substantially seal said reservoir with an electrolyte containable therein to an outside atmosphere during an electroplating process, and

a porous tube couplable to an inert gas source configured to bubble an inert gas through said electrolyte containable therein;

an electroplating cell, coupled to said reservoir, including:

another cover configured to substantially seal said electroplating cell with said electrolyte containable therein to said outside atmosphere during said electroplating process, another porous tube couplable to said inert gas source configured to bubble said inert gas through said electrolyte containable therein,

an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, said electrolyte being configured to enter said semipermeable membrane via a tube through a wall of said semipermeable membrane and coupled to a microporous filter,

a rotating magnet within said electroplating cell and configured to orient an axis of magnetization of said electroplating material for application to a wafer mounted thereon during said electroplating process, and

a partition configured to control a height of said electrolyte containable therein;

and a pH-sensing electrode configured to cooperate with a metering pump control assembly, coupled to an acid/base source, to maintain a particular pH level of said electrolyte containable in said electroplating cell.

12. The electroplating tool as recited in claim 11 further comprising a circulating pump coupled through another tube with a valve to said electroplating cell and said reservoir, said circulating pump configured to pump said electrolyte at a flow rate from said reservoir through said another tube to said electroplating cell through nozzles therein.

13. The electroplating tool as recited in claim 11 wherein said electrolyte is configured to exit said semipermeable membrane via another tube through said semipermeable membrane.

14. The electroplating tool as recited in claim 11 wherein said electroplating cell further comprises a partition configured to control a height further comprising a circulating pump configured to recirculate said electrolyte through said microporous filter.

15. The electroplating tool as recited in claim 11 wherein excess electrolyte containable in said electroplating cell is configured to flow behind a wall therein.

16. The electroplating tool as recited in claim 11 wherein said inert gas comprises nitrogen.

17. The electroplating tool as recited in claim 11 wherein said alloy is formed from cobalt and iron.

18. The electroplating tool as recited in claim 11 wherein said electrolyte comprises phosphorous.

19. The electroplating tool as recited in claim 11 wherein said magnet comprises a current-carrying coil.

20. The electroplating tool as recited in claim 11 wherein said pH-sensing electrode is within one of said electroplating cell and said reservoir.