Integrated circuit system with clean surfaces

1. A method of manufacturing an integrated circuit system comprising:

providing an integrated circuit wafer;

applying a first cleaning solution as a liquid over the integrated circuit wafer; and

applying a second cleaning solution over the integrated circuit wafer to prevent or remove a defect resulting from the first cleaning process.

2. The method as claimed in claim 1 wherein applying the second cleaning solution includes applying a solution having hydrochloric peroxide.

3. The method as claimed in claim 1 wherein applying the second cleaning solution includes applying a de-ionized water rinse.

4. The method as claimed in claim 1 wherein applying the first cleaning solution includes applying a solution having diluted acid.

5. The method as claimed in claim 1 wherein applying the first cleaning solution includes applying a solution having buffered acid.

6. The method as claimed in claim 1 further comprising applying a wafer process layer over the integrated circuit wafer.

7. A method of manufacturing an integrated circuit system comprising:

providing an integrated circuit wafer;

applying a first cleaning solution as a liquid over the integrated circuit wafer;

applying a second cleaning solution over the integrated circuit wafer to prevent or remove a defect resulting from the first cleaning solution; and

applying a wafer process layer over the integrated circuit wafer having the defect substantially eliminated.

8. The method as claimed in claim 7 wherein applying the second cleaning solution includes:

applying a first de-ionized water rinse over the integrated circuit wafer;

applying a hydrochloric peroxide solution over the integrated circuit wafer;

applying a second de-ionized water rinse over the integrated circuit wafer; and

drying the integrated circuit wafer.

9. The method as claimed in claim 7 wherein applying the first cleaning solution includes wet etching an oxide over the integrated circuit wafer.

10. The method as claimed in claim 7 wherein applying the first cleaning solution includes applying a diluted hydrofluoric acid solution.

11. The method as claimed in claim 7 wherein applying the first cleaning solution includes applying a buffered hydrofluoric acid solution.

12. The method as claimed in claim 7 wherein processing the wafer process layer includes applying a silicidation layer over the integrated circuit wafer.

13. A method of manufacturing an integrated circuit system comprising:

providing an integrated circuit wafer having a wafer active surface;

applying a first cleaning solution as a liquid over the wafer active surface;

applying a second cleaning solution over the wafer active surface to prevent or remove a residue or a particle resulting from the first cleaning solution; and

processing a wafer process layer over the wafer active surface having the residue or the particle substantially eliminated.

14. The method as claimed in claim 13 wherein applying the second cleaning solution includes applying a Standard Clean-2 solution having HCL, H 2 O 2 , H 2 O, or combinations thereof.

15. The method as claimed in claim 13 wherein applying the second cleaning solution includes applying a second cleaning solution having HCL, H 2 O 2 , and H 2 O in a ratio range of 1:1:1 to 1:1:1000.

16. The method as claimed in claim 13 wherein applying the first cleaning solution includes forming the residue or the particle from carbon-based contaminants.

17. The method as claimed in claim 13 wherein applying the first cleaning solution includes forming the residue or the particle from an arsenic implant.

18. The method as claimed in claim 13 wherein applying the first cleaning solution includes applying a DHF solution having diluted HF acid resulting in the wafer active surface hydrogen-terminated.

19. The method as claimed in claim 13 wherein applying the first cleaning solution includes applying a BHF solution having buffered HF acid resulting in the wafer active surface hydrogen-terminated.

20. The method as claimed in claim 13 wherein processing the wafer process layer includes applying Co or Ni silicidation over the wafer active surface.