Post passivation interconnection schemes on top of IC chips
A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on the surface of a substrate. A layer of passivation is deposited over the layer of dielectric, a thick second layer of dielectric is created over the surface of the layer of passivation. Thick and wide interconnect lines are created in the thick second layer of dielectric. The first layer of dielectric may also be eliminated, creating the wide thick interconnect network on the surface of the layer of passivation that has been deposited over the surface of a substrate.
1. A method for fabricating a chip, comprising:
providing a silicon substrate, a first internal circuit in or on said silicon substrate, a second internal circuit in or on said silicon substrate, a first interconnecting structure over said silicon substrate, wherein said first interconnecting structure is connected to said first internal circuit, and a second interconnecting structure over said silicon substrate, wherein said second interconnecting structure is connected to said second internal circuit, wherein said first and second interconnecting structures are formed by a process comprising a damascene process, an electroplating process and a CMP process; and
forming a third interconnecting structure over said silicon substrate, wherein said first internal circuit is connected to said second internal circuit through, in sequence, said first interconnecting structure, said third interconnecting structure and said second interconnecting structure, and wherein said forming said third interconnecting structure comprises forming a first metal layer, followed by forming a patterned photoresist layer, followed by electroplating a second metal layer, followed by removing said patterned photoresist layer, followed by etching said first metal layer.
2. The method of claim 1 , wherein said forming said first metal layer comprises a sputtering process.
3. The method of claim 1 further comprising providing a third internal circuit in or on said silicon substrate, wherein said first interconnecting structure is connected to said third internal circuit, wherein said first internal circuit is connected to said third internal circuit through said first interconnecting structure, and wherein said third internal circuit is connected to said second internal circuit through, in sequence, said first interconnecting structure, said third interconnecting structure and said second interconnecting structure.
4. The method of claim 3 further comprising providing a fourth internal circuit in or on said silicon substrate, wherein said first interconnecting structure is connected to said fourth internal circuit, wherein said first and third internal circuits are connected to said fourth internal circuit through said first interconnecting structure, and wherein said fourth internal circuit is connected to said second internal circuit through, in sequence, said first interconnecting structure, said third interconnecting structure and said second interconnecting structure.
5. The method of claim 3 further comprising providing a fourth internal circuit in or on said silicon substrate, wherein said second interconnecting structure is connected to said fourth internal circuit, wherein said second internal circuit is connected to said fourth internal circuit through said second interconnecting structure, and wherein said first and third internal circuits are connected to said fourth internal circuit through, in sequence, said first interconnecting structure, said third interconnecting structure and said second interconnecting structure.
6. The method of claim 1 , wherein said third interconnecting structure comprises a clock bus over said silicon substrate, wherein said first internal circuit is connected to said second internal circuit through said clock bus.
7. The method of claim 1 , wherein said third interconnecting structure comprises a signal bus over said silicon substrate, wherein said first internal circuit is connected to said second internal circuit through said signal bus.
8. The method of claim 1 , wherein said third interconnecting structure comprises a power bus over said silicon substrate, wherein said first internal circuit is connected to said second internal circuit through said power bus.
9. The method of claim 1 , wherein said third interconnecting structure comprises a ground bus over said silicon substrate, wherein said first internal circuit is connected to said second internal circuit through said ground bus.
10. The method of claim 1 further comprising providing a dielectric layer over said silicon substrate, wherein said first and second interconnecting structures are in said dielectric layer, and a passivation layer over said dielectric layer, wherein said passivation layer comprises a nitride, and wherein said forming said third interconnecting structure comprises said forming said third interconnecting structure further over said passivation layer.
11. The method of claim 10 further comprising providing a polymer layer over said passivation layer, wherein said third interconnecting structure is in said polymer layer.
12. The method of claim 11 , wherein said polymer layer has a thickness greater than 2 micrometers.
13. The method of claim 1 , wherein said third interconnecting structure comprises an interconnect line having a thickness greater than 1 micrometer.
14. A method for fabricating a chip, comprising:
providing a silicon substrate, an internal circuit in or on said silicon substrate, and a first interconnecting structure over said silicon substrate, wherein said first interconnecting structure is connected to said internal circuit, and wherein said first interconnecting structure is formed by a process comprising a damascene process, an electroplating process and a CMP process; and
forming a second interconnecting structure over said silicon substrate, wherein said second interconnecting structure is connected to said internal circuit through said first interconnecting structure, and wherein said forming said second interconnecting structure comprises forming a first metal layer, followed by forming a patterned photoresist layer, followed by electroplating a second metal layer, followed by removing said patterned photoresist layer, followed by etching said first metal layer.
15. The method of claim 14 , wherein said forming said first metal layer comprises a sputtering process.
16. The method of claim 14 further comprising providing an ESD circuit in or on said silicon substrate, wherein said internal circuit is connected to said ESD circuit through, in sequence, said first interconnecting structure and said second interconnecting structure.
17. The method of claim 14 further comprising providing a driver, receiver or I/ 0 circuit in or on said silicon substrate, wherein said internal circuit is connected to said driver, receiver or I/O circuit through, in sequence, said first interconnecting structure and said second interconnecting structure.
18. The method of claim 14 further comprising providing a dielectric layer over said silicon substrate, wherein said first interconnecting structure is in said dielectric layer, and a passivation layer over said dielectric layer, wherein said passivation layer comprises a nitride, and wherein said forming said second interconnecting structure comprises said forming said second interconnecting structure further over said passivation layer.
19. The method of claim 18 further comprising providing a polymer layer over said passivation layer, wherein said second interconnecting structure is in said polymer layer.
20. The method of claim 19 , wherein said polymer layer has a thickness greater than 2 micrometers.