IP Library Granted Patent US 7,635,902
Granted Patent B2
US 7,635,902 · App. 11/867,189 · Granted Dec 22, 2009

Low power magnetoelectronic device structures utilizing enhanced permeability materials

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Quick Facts
Patent No.
US 7,635,902
App. No.
11/867,189
Granted
Dec 22, 2009
Kind
B2
Abstract

Low power magnetoelectronic device structures and methods for making the same are provided. One magnetoelectronic device structure ( 100 ) comprises a programming line ( 104 ), a magnetoelectronic device ( 102 ) magnetically coupled to the programming line, and an enhanced permeability dielectric material ( 106 ) disposed adjacent the magnetoelectronic device. The enhanced permeability dielectric material has a permeability no less than approximately 1.5. A method for making a magnetoelectronic device structure is also provided. The method comprises fabricating a magnetoelectronic device ( 102 ) and depositing a conducting line ( 104 ). A layer of enhanced permeability dielectric material ( 106 ) having a permeability no less than approximately 1.5 is formed, wherein after the step of fabricating a magnetoelectronic device and the step of depositing a conducting line, the layer of enhanced permeability dielectric material is situated adjacent the magnetoelectronic device.

Claims (12)

1. A magnetoelectronic device structure comprising:

a programming line;

a magnetoelectronic device magnetically coupled to said programming line; and

a first enhanced permeability dielectric material disposed adjacent to said magnetoelectronic device, said first enhanced permeability dielectric material having a magnetic permeability no less than approximately 1.5 and comprising alternating layers of at least one dielectric material and at least one magnetic nanoparticle material that exhibits super-paramagnetic behavior, wherein each of said layers of at least one magnetic nanoparticle material comprises a discontinuous layer of magnetic nanoparticles; and

an oxygen barrier layer overlying each of said layers of at least one magnetic nanoparticle material.

2. The magnetoelectronic device structure of claim 1 , said first enhanced permeability dielectric material having a magnetic permeability in the range of about 2 to about 60.

3. The magnetoelectronic device structure of claim 1 , said first enhanced permeability dielectric material disposed between said programming line and said magnetoelectronic device.

4. The magnetoelectronic device structure of claim 1 , further comprising an additional enhanced permeability material disposed between said magnetoelectronic device and said programming line, said additional enhanced material having a magnetic permeability no less than approximately 1.5.

5. The magnetoelectronic device structure of claim 4 , wherein said additional enhanced permeability material is a conductive material.

6. The magnetoelectronic device structure of claim 1 , wherein said first enhanced permeability dielectric material is formed from at least one dielectric material selected from the group consisting of alumina, silicon dioxide, silicon nitride, and oxides of magnesium, hafnium, tantalum, titanium, vanadium, and niobium and from at least one magnetic material selected from the group consisting of nickel, iron, cobalt, alloys of nickel, alloys of iron, alloys of cobalt, and combinations thereof.

7. The magnetoelectronic device structure of claim 1 , wherein said at least one dielectric material is formed from a material selected from the group consisting of alumina, silicon dioxide, silicon nitride, and oxides of magnesium, hafhnium, tantalum, titanium, vanadium, and niobium and wherein said at least one magnetic nanoparticle material comprises a material selected from the group consisting of nickel, iron, cobalt, alloys of nickel, alloys of iron, alloys of cobalt, and combinations thereof.

8. The magnetoelectronic device structure of claim 1 , wherein said at least one magnetic nanoparticle material comprises nanoparticles having a size in the range of about 2 nm to about 10 nm.

Assignments (15)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
PATENT RELEASE Recorded Aug 17, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 039707/0471 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037354/0670 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2015
From: FREESCALE SEMICONDUCTOR, INC.
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 036084/0057 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2010
From: CITIBANK, N.A.
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 024767/0398 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2009
From: FREESCALE SEMICONDUCTOR, INC.
To: EVERSPIN TECHNOLOGIES, INC.
Reel/Frame 022366/0467 →
SECURITY AGREEMENT Recorded Jul 11, 2008
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A.
Reel/Frame 021217/0368 →