Circuit board structure having embedded semiconductor element and fabrication method thereof

1. A circuit board structure having an embedded semiconductor element, comprising:

a carrier board having a first surface, a second surface, and at least one through hole penetrating the carrier board from the first surface to the second surface;

a first semiconductor element received in the through hole and having an active surface and an inactive surface, the active surface of the first semiconductor element having a plurality of electrode pads;

at least one second semiconductor element mounted on a surface of the carrier board and having an active surface and an inactive surface, the active surface of the second semiconductor element having a plurality of electrode pads, and the second semiconductor element being mounted on the second surface of the carrier board via the inactive surface of the second semiconductor element;

a first encapsulation layer formed on the first surface of the carrier board to block one end of the through hole of the carrier board;

a second encapsulation layer formed on the second surface of the carrier board and the second semiconductor element,

wherein the first and the second encapsulation layers integrate with one another and fill the through hole of the carrier board, so as to secure the first semiconductor element to the through hole and expose the electrode pads; and

a circuit build-up structure formed on a surface of the second encapsulation layer, wherein the circuit build-up structure has a plurality of conductive structures for electrical connection with the electrode pads of the first semiconductor element and the electrode pads of the second semiconductor element.

2. The circuit board structure having an embedded semiconductor element of claim 1 , wherein the carrier board is one of an insulating board and a ceramic plate.

3. The circuit board structure having an embedded semiconductor element of claim 1 , wherein the first semiconductor element is one of an active element and an inactive element.

4. The circuit board structure having an embedded semiconductor element of claim 1 , wherein the second semiconductor element is one of an active element and an inactive element.

5. The circuit board structure having an embedded semiconductor element of claim 3 or claim 4 , wherein the active element is one selected from the group consisting of a memory, a wireless chip, and a microprocessor chip.

6. The circuit board structure having an embedded semiconductor element of claim 3 or claim 4 , wherein the inactive element is one selected from the group consisting of a resistor, a capacitor, and an inductor.

7. The circuit board structure having an embedded semiconductor element of claim 1 , wherein the carrier board is a circuit board formed with a circuit layer, and the first and second surfaces of the circuit board have a plurality of electrically connecting pads disposed thereon.

8. The circuit board structure having an embedded semiconductor element of claim 7 , wherein the circuit board has one of single-layered circuit and multi-layered circuit.

9. The circuit board structure having an embedded semiconductor element of claim 8 , wherein the electrode pads of the second semiconductor element are exposed from the second encapsulation layer.

10. The circuit board structure having an embedded semiconductor element of claim 7 or claim 9 , further comprising another second semiconductor element mounted on the electrically connecting pads on one of the first surface and the second surface of the carrier board via the active surface.

11. The circuit board structure having an embedded semiconductor element of claim 1 , wherein a plurality of electrically connecting pads are disposed on the outer surface of the circuit build-up structure.

12. The circuit board structure having an embedded semiconductor element of claim 11 , further comprising a solder mask formed on the outer surface of the circuit build-up structure and formed with a plurality of openings for exposing the electrically connecting pads on the outer surface of the circuit build-up structure.

13. The circuit board structure having an embedded semiconductor element of claim 1 , wherein the circuit build-up structure comprises at least one dielectric layer, a circuit layer stacked on the dielectric layer, and the conductive structures formed in the dielectric layer.

14. The circuit board structure having an embedded semiconductor element of claim 1 , wherein the first encapsulation layer is formed with an aperture for exposing the inactive surface of the first semiconductor element.