Semiconductor device and manufacturing method of the same
View Patent ↗A semiconductor device, includes a wiring board; a first semiconductor element mounted on the wiring board; a second semiconductor element mounted on the first semiconductor element so that a position of the second semiconductor element is shifted relative to a position of the first semiconductor element; wherein a part of a main surface of the second semiconductor element faces the first semiconductor element; and an electrode pad provided on the main surface of the second semiconductor element is connected to a second semiconductor element connection pad of the wiring board by a connection part.
1. A semiconductor device, comprising:
a wiring board;
a first semiconductor element mounted over the wiring board; and
a second semiconductor element mounted over the first semiconductor element so that a position of the second semiconductor element is shifted relative to a position of the first semiconductor element,
wherein a part of a main surface of the second semiconductor element faces an electronic circuit forming surface of the first semiconductor element,
an electrode pad provided on the main surface of the second semiconductor element is connected to a second semiconductor element connection pad of the wiring board by an integral connection part,
the wiring board and the first semiconductor element are directly fixed to each other by a first adhesive, and
a substantial portion of the periphery of the connection part is covered with the first adhesive.
2. The semiconductor device as claimed in claim 1 ,
further comprising:
a second adhesive configured to fix the second semiconductor element to the first semiconductor element.
3. The semiconductor device as claimed in claim 2 ,
wherein the wiring board includes a first semiconductor element connection pad,
the first semiconductor includes an electrode pad, and
the first semiconductor element connection pad and the electrode pad of the first semiconductor element are connected to each other by a bonding wire.
4. The semiconductor device as claimed in claim 3 ,
wherein a dam configured to prevent overflow of the second adhesive is provided in the vicinity of the electrode pad of the first semiconductor element.
5. The semiconductor device as claimed in claim 1 ,
wherein the wiring board and the first semiconductor element are fixed to each other by a first adhesive;
the first semiconductor element and the second semiconductor element are fixed to each other by a second adhesive; and
the connection part is covered with a third adhesive.
6. The semiconductor device as claimed in claim 1 ,
wherein side surfaces of the first semiconductor element and the second semiconductor element are sealed by a sealing resin over the wiring board with a rear surface of the second semiconductor element being exposed to an outside.
7. The semiconductor device as claimed in claim 1 ,
wherein a side surface of the first semiconductor element and another main surface and a side surface of the second semiconductor element are resin-sealed.
8. The semiconductor device as claimed in claim 1 ,
wherein the connection part is formed by one or more bumps.
9. The semiconductor device as claimed in claim 8 ,
wherein the one or more bumps are connected to the second semiconductor element connection pad of the wiring board by a conductive member.
10. The semiconductor device as claimed in claim 1 ,
wherein a plurality of the first semiconductor elements having a substantially same thickness is mounted over the wiring board; and
the second semiconductor element bridges the plural first semiconductor elements.
11. The semiconductor device as claimed in claim 1 ,
wherein a plurality of the second semiconductor element is mounted over the first semiconductor element.