Conductive polishing article for electrochemical mechanical polishing
Embodiments of a polishing article for polishing a substrate are provided. In one embodiment, the polishing article includes an annular upper layer made of a dielectric material coupled to an annular lower layer made of a conductive material, and an annular subpad sandwiched between the annular upper layer and the annular lower layer forming a replaceable assembly therewith.
1. A polishing article for polishing a substrate, comprising:
an upper layer having a polishing surface made of a dielectric material that is disposed on a subpad;
a conductive layer disposed on the subpad opposite the upper layer; and
a plurality of concentric apertures formed through the upper layer and the subpad exposing the conductive layer, wherein each of the upper layer, the subpad, and the conductive layer define a central opening adapted to receive at least one conductive contact element.
2. The polishing article of claim 1 , wherein the subpad has a hardness between about 20 Shore A and about 90 Shore A.
3. The polishing article of claim 1 , wherein the conductive layer is fabricated from stainless steel.
4. The polishing article of claim 1 , wherein the conductive layer further comprises a plurality of independently biasable electrical zones.
5. The polishing article of claim 4 , wherein the electrical zones further comprise concentric rings.
6. The polishing article of claim 1 , wherein the subpad comprises at least one of polyurethane, polyurethane mixed with fillers, polycarbonate, polyphenylene sulfide (PPS), ethylene-propylene-diene-methylene (EPDM), polytetrafluoroethylene polymers, compressed felt fibers impregnated with urethane, or combinations thereof.
7. The polishing article of claim 6 , wherein the conductive layer comprises stainless steel.
8. The polishing article of claim 1 , wherein the upper layer comprises a polyurethane material and the conductive layer comprises stainless steel.
9. The polishing article of claim 1 , wherein the subpad, the conductive layer and the upper layer are coupled by at least one of compression molding, staking, fastening, adhering and bonding.
10. A polishing article for polishing a substrate, comprising:
an upper layer having a polishing surface made of a dielectric polymer material;
a conductive metal layer comprising a plurality of independently biasable electrical zones;
a subpad disposed between the conductive metal layer and the upper layer, the subpad comprising a material selected from polyurethane, polyurethane mixed with fillers, polycarbonate, polyphenylene sulfide (PPS), ethylene-propylene-diene-methylene (EPDM), polytetrafluoroethylene polymers, compressed felt fibers impregnated with urethane, or combinations thereof; and
a plurality of concentrically aligned apertures formed through the upper layer and the subpad to expose the conductive metal layer, wherein each of the upper layer, the subpad, and the conductive layer define a central opening adapted to receive a housing having conductive contact elements disposed therein.
11. The polishing article of claim 10 , wherein the subpad, the conductive metal layer and the upper layer are coupled by at least one of compression molding, staking, fastening, adhering and bonding.
12. The polishing article of claim 10 , wherein the electrical zones further comprise concentric rings.
13. The polishing article of claim 10 , wherein the conductive metal layer further comprises at least one insulating spacer separating the zones.
14. The polishing article of claim 10 , wherein the electrical zones further comprise concentric rings separated by at least one insulating spacer.
15. The polishing article of claim 10 , wherein the electrical zones further comprise concentric rings separated by a gap.
16. A polishing article for polishing a substrate, comprising:
an upper layer having a grooved polishing surface comprising polyurethane;
a conductive metal layer comprising a plurality of independently biasable concentric rings adapted to be disposed on a platen;
a subpad disposed between the conductive metal layer and the upper layer, the subpad comprising a material selected from polyurethane, polyurethane mixed with fillers, polycarbonate, polyphenylene sulfide (PPS), ethylene-propylene-diene-methylene (EPDM), polytetrafluoroethylene polymers, compressed felt fibers impregnated with urethane, or combinations thereof; and
a plurality of concentrically aligned apertures formed through the upper layer and the subpad to expose the conductive metal layer, wherein the upper layer, the subpad, and the conductive metal layer are coupled by at least one of compression molding, staking, fastening, adhering and bonding and each define a central opening therethrough.
17. The polishing article of claim 16 , wherein the concentric rings are separated by at least one insulating spacer.
18. The polishing article of claim 16 , wherein the concentric rings are separated by a gap.