Cleaning device for chemical mechanical polishing equipment
A cleaning device for chemical-mechanical equipment, which includes: an irrotatable center shaft irrotatably coupled with a spindle which is rotated, the irrotatable center shaft including a first channel and a second channel formed in an interior of the irrotatable center shaft, cleaning liquid flowing into the first channel and compressed gas flowing into the second channel; and a nozzle block coupled with the spindle so as to revolve about the irrotatable center shaft above a polishing pad, the nozzle block mixing cleaning liquid supplied through the first channel with compressed gas supplied through the second channel so as to generate twin-fluid, and pressure-injecting the mixed twin-fluid on the polishing pad. Accordingly, cleaning liquid is pressurized so as to be rapidly injected on a polishing pad so that slurry particles and alien substances on the polishing pad are completely removed. Furthermore, wafer scratch can be prevented and the life of the polishing pad can also be increased.
1. A cleaning device for a chemical-mechanical polishing equipment, comprising:
a irrotatable center shaft irrotatably coupled with a spindle which is rotated, the irrotatable center shaft including a first channel and a second channel which are formed in an interior of the irrotatable center shaft, cleaning liquid flowing into the first channel and compressed gas flowing into the second channel; and
a nozzle block coupled with the spindle so as to revolve about the irrotatable center shaft above a polishing pad, the nozzle block mixing cleaning liquid supplied through the first channel with compressed gas supplied through the second channel so as to generate twin-fluid and pressure-injecting the mixed twin-fluid on the polishing pad.
2. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 1 , wherein the nozzle block comprises a first block, which is supplied with cleaning liquid through the first channel and injects the cleaning liquid on the polishing pad, and a second block which is supplied compressed gas through the second channel and supplies the compressed gas to the first block so as to rapidly inject the cleaning liquid from the first block on the polish pad.
3. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 2 , wherein the first block has a plurality of injection openings having injection areas overlapped with each other from a center of the polishing pad toward a radius direction of the polishing pad.
4. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 3 , wherein the second block can supply compressed gas to respective injection openings of the first block.
5. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 4 , wherein compressed gas supplied to the second channel comprises nitrogen gas.
6. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 5 , wherein the first block injects only nitrogen gas supplied through the second channel when supply of cleaning liquid supplied through the first channel is cut off.
7. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 3 , wherein compressed gas supplied to the second channel comprises nitrogen gas.
8. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 7 , wherein the first block injects only nitrogen gas supplied through the second channel when supply of cleaning liquid supplied through the first channel is cut off.
9. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 2 , wherein compressed gas supplied to the second channel comprises nitrogen gas.
10. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 9 , wherein the first block injects only nitrogen gas supplied through the second channel when supply of cleaning liquid supplied through the first channel is cut off.
11. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 1 , wherein a rotary fitting is installed at a portion where the nozzle block and the irrotatable center shaft are coupled with each other.
12. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 11 , wherein compressed gas supplied to the second channel comprises nitrogen gas.
13. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 12 , wherein the first block injects only nitrogen gas supplied through the second channel when supply of cleaning liquid supplied through the first channel is cut off.
14. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 1 , wherein compressed gas supplied to the second channel comprises nitrogen gas.
15. The cleaning device for a chemical-mechanical polishing equipment as claimed in claim 14 , wherein the first block injects only nitrogen gas supplied through the second channel when supply of cleaning liquid supplied through the first channel is cut off.