IP Library › Granted Patent US 8,196,610
Granted Patent B2
US 8,196,610 · App. 11/881,286 · Granted Jun 12, 2012

Controlling cooling fluid flow in a cooling system with a variable orifice

Assignee: Hewlett-Packard Development Company, L.P.
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Quick Facts
Patent No.
US 8,196,610
App. No.
11/881,286
Filed
Jul 26, 2007
Granted
Jun 12, 2012
Kind
B2
Art Unit
3753
USPC
138/45
Abstract

In a cooling system, a variable orifice controls the flow of cooling fluid through a cooling fluid flow path. The variable orifice includes an adjustable diaphragm shutter through which the cooling fluid flows. Upon manipulation of the adjustable diaphragm shutter, a diameter of an opening of the adjustable diaphragm shutter is adjusted to control the flow of the cooling fluid.

Claims (36)

1. A cooling system for an electronic device, the cooling system comprising:

a cooling fluid flow path through which a cooling fluid flows;

a variable orifice in the cooling fluid flow path and comprising an adjustable diaphragm shutter comprising overlapping blades that form an opening through which the cooling fluid flows, wherein upon manipulation of the adjustable diaphragm shutter, a diameter of the opening is adjusted to control the flow of the cooling fluid;

the cooling fluid flow path comprising a pipe attached to the variable orifice and through which the cooling fluid flows to the variable orifice;

a pump to force the cooling fluid through the pipe and variable orifice; and

a heat exchanger that passes heat from a cooling air to the cooling fluid, wherein the pump forces the cooling fluid via the cooling fluid flow path through the heat exchanger, and wherein a fan transfers the cooling air via a cooling air flow path through the heat exchanger to across heat generating components of the electronic device.

2. A cooling system as defined in claim 1 , wherein:

the variable orifice controls a pressure decrease in the cooling fluid; and

the cooling fluid comprises water or Freon.

3. A cooling system as defined in claim 1 , wherein the overlapping blades each have a concave curvature on a side edge that defines the opening, and the overlapping blades are continuously adjustable between a maximum and a minimum diameter of the opening.

4. A cooling system as defined in claim 1 , wherein a maximum diameter of the opening matches an inner diameter of the pipe.

5. A method for controlling cooling fluid flow in a cooling system of an electronic device, the method comprising:

forcing via a pump the cooling fluid comprising a liquid through a cooling fluid flow path which includes a variable orifice that has an adjustable diaphragm shutter comprising overlapping blades that form an opening through which the cooling fluid flows, wherein the cooling fluid flow path comprises a pipe attached to the variable orifice and through which the cooling fluid flows to the variable orifice;

manipulating the adjustable diaphragm shutter to change a diameter of the opening, the change in the diameter of the opening causing a change in a flow rate of the cooling fluid to control temperature in the electronic device; and

a heat exchanger that passes heat from a cooling air to the cooling fluid, wherein the pump forces the cooling fluid via the cooling fluid flow path through the heat exchanger, and wherein a fan transfers the cooling air via a cooling air flow path through the heat exchanger to across heat generating components of the electronic device.

6. A method as defined in claim 5 , wherein:

the manipulating of the adjustable diaphragm shutter comprises adjusting the overlapping blades between a maximum and a minimum diameter of the opening.

7. A method as defined in claim 6 , wherein adjusting of the overlapping blades comprises pivoting the overlapping blades toward a center point of the opening to decrease the diameter of the opening and decrease the flow rate of the cooling fluid.

8. The cooling system of claim 1 , wherein the overlapping blades each have a curved slot to receive a respective pin to facilitate adjusting of the overlapping blades.

9. The method of claim 5 , wherein the cooling fluid comprises water.

10. The method of claim 6 , wherein manipulating the adjustable diaphragm shutter comprises adjusting the overlapping blades via respective curved slots on the overlapping blades.

11. The cooling system of claim 1 , comprising a cooling unit to cool the cooling fluid, wherein the pump forces the cooling fluid via the cooling fluid flow path through the cooling unit.

12. The cooling system of claim 1 , comprising:

the electronic device, wherein the cooling system removes heat from heat generating components of the electronic device; and

a controller electrically connected to the variable orifice by signal wires, wherein the controller controls an amount to which the variable orifice restricts the flow of the cooling fluid.

13. A cooling system for an electronic device, the cooling system comprising:

a heat exchanger that passes heat from a cooling air to a cooling fluid;

a fan that transfers the cooling air via a cooling air path through the heat exchanger to across heat generating components of the electronic device;

a cooling unit that cools the cooling fluid;

a pump that circulates the cooling fluid via a cooling fluid flow path through the heat exchanger and the cooling unit; and

a variable orifice in the cooling fluid flow path and comprising an adjustable diaphragm shutter comprising overlapping blades the form an opening through which the cooling fluid flows, wherein upon manipulation of the adjustable diaphragm shutter, a diameter of an opening of the adjustable diaphragm shutter is adjusted to control flow rate of the cooling fluid.

14. The cooling system of claim 13 , comprising a controller electrically connected to the variable orifice by signal wires, wherein the controller controls an amount to which the variable orifice regulates the flow rate of the cooling fluid, and the variable orifice causes a pressure drop in the cooling fluid across the variable orifice.

15. The cooling system of claim 13 , comprising the electronic device having the heat generating components, wherein the cooling system removes heat from the heat generating components.

16. The cooling system of claim 13 , wherein:

the overlapping blades each have a concave curvature on a side edge that defines the opening; and

the fan transfers the cooling air via the cooling air path from the electronic device back to the heat exchanger.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 9, 2015
From: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
To: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
Reel/Frame 037079/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2007
From: MURAKAMI, VANCE B.; WILLEVER, TONY; GRISHMAN, JOHN M.
To: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Reel/Frame 019685/0864 →
Continuity (1)
Related Publication 20090025416A1 · Jan 29, 2009