Modular Sub-Assembly of Semiconductor Strips
A modular subassembly ( 100 ) of elongated semiconductor strips ( 110 ) and a method of making the same are disclosed. Supporting media ( 120 ) supports the elongated semiconductor strips ( 110 ). Elongated semiconductor strips ( 110 ) are disposed on and affixed to the supporting media ( 120 ). The supporting media ( 120 ) may be configured in a number of ways.
1 . A modular subassembly of elongated semiconductor strips, comprising: supporting media to support elongated semiconductor strips; and a plurality of elongated semiconductor strips disposed on and affixed to said supporting media.
2 . The subassembly according to claim 1 , wherein said elongated semiconductor strips are disposed on said supporting media in a parallel configuration.
3 . The subassembly according to claim 1 , wherein said elongated semiconductor strips are formed from a wafer of semiconductor material.
4 . The subassembly according to claim 1 , wherein equipment including one or more of robotics handling equipment, a lay-up machine, a tabbing machine, and a stringer are used to handle said subassembly.
5 . The subassembly according to claim 1 , wherein said supporting media is transparent or at least translucent.
6 . The subassembly according to claim 1 , wherein said supporting media is opaque.
7 . The subassembly according to claim 1 , wherein said supporting media is selected from the group of materials consisting of fiberglass, metal, ceramics, insulators, and plastics.
8 . The subassembly according to claim 7 , wherein said plastics include polyvinyl fluoride (PVF), polyester, fluoropolymer film (ETFE), or polyimide.
9 . The subassembly according to claim 1 , wherein said supporting media is able to withstand processing temperatures in the range selected from the group consisting of about 1 OOOC and about 250° C., about 100° C. to about 170° C., about 200° C. to about 250° C., and about 100° C. to about 200° C.
10 . The subassembly according to claim 1 , wherein said supporting media comprises insulative material and conductive metal portions formed with said insulative material.
11 . The subassembly according to claim 1 , wherein said supporting media comprises conductive material and insulative portions formed with said conductive material.
12 . The subassembly according to claim 1 , wherein said supporting media is configured as tracks, ribbons, full sheets, processed full sheets, film, rectangles, a ladder configuration, a sheet with perforations or punch holes, and angled bars.
13 . The subassembly according to claim 1 , wherein said supporting media comprises at least one of ribbons and tracks, and further comprises additional structural support for bracing.
14 . The subassembly according to claim 1 , wherein said elongated semiconductor strips are photovoltaic cells.
15 . The subassembly according to claim 14 , wherein said subassembly is a photovoltaic device.
16 . The subassembly according to claim 1 , wherein said sub-assembly is flexible.
17 . The subassembly according to claim 1 , wherein said sub-assembly is conformable.
18 . The subassembly according to claim 1 , wherein said sub-assembly is rigid.
19 . A tabbed subassembly, comprising: a subassembly in accordance with claim 1 ; and a plurality of tabs coupled to said subassembly for connecting said subassembly with another tabbed subassembly.
20 . A panel, comprising: at least two tabbed subassemblies in accordance with claim 19 and at least one interconnecting mechanism coupling at least one tab of a tabbed subassembly with at least one tab of another tabbed subassembly.
21 . The panel according to claim 20 , wherein said at least two tabbed subassemblies are interconnected in series or in parallel dependent upon the current or voltage to be produced.