Method and Device for Tempering a Substrate

1 . A device for regulating the temperature of a substrate (S) comprising:

a first partial element ( 10 ) which has a bearing area ( 20 ) for bearing against the substrate (S) and also a first connecting area ( 22 ), and

a second partial element ( 12 ), which has a second connecting area ( 28 ), via which it bears at least partly against the first connecting area ( 22 ) of the first partial element ( 10 ),

wherein at least one of the two partial elements ( 10 , 12 ) comprises ceramic material,

at least one cutout ( 24 , 30 ) which defines at least one cavity ( 32 ) in the device is provided at least in one of the two connecting areas ( 22 , 28 ), and

at least one first connection opening ( 48 ) is provided via which a temperature-regulating fluid inflow and/or outflow to and/or from the at least one cavity ( 32 ) is made possible.

2 . The device as claimed in claim 1 , wherein in addition at least one second connection opening ( 52 ) is provided via which a fluid outflow and/or inflow from and/or to the at least one cavity ( 32 ) is made possible.

3 . The device as claimed in claim 2 , wherein the cavity ( 32 ) forms at least one continuous channel between the first ( 48 ) and the second connection opening ( 52 ).

4 . The device as claimed in claim 3 , wherein the at least one continuous channel runs essentially in meandering fashion.

5 . The device as claimed in claim 3 , wherein the continuous channel is arranged in such a way that a fluid throughflow from the first connection opening through the channel to the second connection opening takes place essentially on the basis of the countercurrent principle.

6 . The device as claimed in claim 3 , wherein ribs ( 34 ) are formed in the channel, the longitudinal direction of said ribs running in the direction of the channel.

7 . The device as claimed in claim 1 , wherein in each case at least one cutout ( 24 , 30 ) is provided in both partial elements ( 10 , 12 ), which cutouts together form the at least one cavity ( 32 ).

8 . The device as claimed in claim 7 , wherein the connecting areas ( 22 , 28 ) lie essentially in a connecting plane and the cutouts ( 24 , 30 ) are formed in the two partial elements symmetrically with respect to the connecting plane.

9 . The device as claimed in claim 1 , wherein an electrically conductive connecting layer ( 26 ) is arranged at at least one of the two connecting areas ( 22 , 28 ), said connecting layer preferably comprising nickel or copper.

10 . The device as claimed in claim 1 , wherein an electrically conductive first shielding layer ( 18 ) is arranged at least partly at the bearing area ( 20 ).

11 . The device as claimed in claim 1 , wherein the second partial element ( 12 ) additionally has an outer area ( 36 ) at which an electrically conductive second shielding layer ( 38 ) is arranged at least in regions.

12 . The device as claimed in claim 1 , wherein the second partial element ( 12 ) has an outer area ( 36 ) onto which an integrated heating element ( 40 ) is arranged and/or an external heating element can be fitted.

13 . A method for producing a device for regulating the temperature of a substrate (S) comprising the following steps in this order:

(a) providing a first partial element ( 10 ) having a bearing area ( 20 ) and a first connecting area ( 22 ) and a second partial element ( 12 ) having a second connecting area ( 28 ), wherein at least one of the two partial elements ( 10 , 12 ) comprises ceramic material;

(b) forming at least one cutout ( 24 , 30 ) in at least one of the two connecting areas ( 22 , 28 );

(c) connecting the first connecting area ( 22 ) of the first partial element ( 10 ) to the second connecting area ( 28 ) of the second partial element ( 12 ) in such a way that the at least one cutout ( 24 , 30 ) forms a cavity ( 32 ) in the device,

wherein

at least one connection opening ( 48 ) is formed via which a temperature- regulating fluid inflow and/or outflow to and/or from the at least one cavity ( 32 ) is made possible.

14 . The method as claimed in claim 13 , wherein step (c) of connecting the two partial elements ( 10 , 12 ) comprises brazing.

15 . The method as claimed in claim 13 , wherein step (a) of providing the first ( 10 ) and second partial element ( 12 ) comprises a step of forming the first ( 10 ) and/or second partial element ( 12 ) as a first and/or a second green blank composed of ceramic material.

16 . The method as claimed in claim 15 , which additionally comprises a step of firing the first and/or second partial element formed as green blank, wherein step (b) of forming the at least one cutout ( 24 , 30 ) is effected before the step of firing the corresponding partial element in which the cutout ( 24 , 30 ) is formed.

17 . The method as claimed in one of claims 13 to 16 , which additionally comprises a step of forming at least a first electrically conductive shielding layer ( 18 ) at the bearing area ( 20 ) and/or a second electrically conductive shielding layer ( 38 ) at an outer area ( 36 ) of the second partial element ( 12 ).

18 . A method for regulating the temperature of a substrate (S), comprising the following steps:

providing a device for regulating the temperature of a substrate the device having a first partial element ( 10 ) which has a bearing area ( 20 ) for bearing against the substrate (S) and also a first connecting area ( 22 ), and a second partial element ( 12 ), which has a second connecting area ( 28 ), via which it bears at least partly against the first connecting area ( 22 ) of the first partial element ( 10 ), wherein at least one of the two partial elements ( 10 , 12 ) comprises ceramic material, at least one cutout ( 24 , 30 ) which defines at least one cavity ( 32 ) in the device is provided at least in one of the two connecting areas ( 22 , 28 ), and at least one first connection opening ( 48 ) is provided via which a temperature-regulating fluid inflow and/or outflow to and/or from the at least one cavity ( 32 ) is made possible, the device having;

arranging the substrate (S) at least partly against the bearing area ( 20 );

supplying and/or discharging a fluid to and/or from the at least one cavity ( 32 ) via the at least one first connection opening ( 48 ).

19 . The method as claimed in claim 18 , wherein the fluid is supplied to the at least one cavity ( 32 ) via the at least one first connection opening ( 48 ) and is discharged from the at least one cavity ( 32 ) via the at least one second connection opening ( 52 ).

20 . The method as claimed in claim 19 , wherein the temperature and/or the flow rate of the supplied fluid is varied for the open-loop or closed-loop control of the temperature of the substrate (S).

21 . The method as claimed in claim 18 , wherein vacuum grooves are formed in the bearing area ( 20 ) and the method additionally comprises a step of sucking up the substrate (S) by means of the vacuum grooves.

22 . The method as claimed in claim 18 , further comprising:

arranging an electrically conductive first shielding layer ( 18 ) at least Partly at the bearing area ( 20 );

arranging an electrically conductive second shielding layer ( 38 ) at least in regions of an outer area ( 36 ) of the second partial element;

arranging an integrated heating element ( 40 ) onto an outer area ( 36 ) of the second partial element ( 12 );

applying force potential to the first shielding layer ( 18 ),

applying shield potential to the second shielding layer ( 38 ), and

applying guard potential to the connecting layer ( 26 ).

23 . The method as claimed in claim 18 , wherein a heating element ( 40 ) is arranged at an outer area ( 36 ) of the second partial element ( 12 ) and an open-loop or closed-loop control of the temperature of the substrate (S) comprises an open-loop or closed-loop control of the temperature and/or the heating power of the heating element ( 40 ).