Electronic component device
An electronic component device of the present invention includes: a silicon package unit having a structure in which a through electrode provided to a silicon substrate while an electrode post connected to the through electrode is provided upright on an upper side of the silicon substrate; an electronic component mounted on the electrode post and having a connection terminal connected to the top end of the electrode post; and a cap package unit joined onto a periphery of the silicon package unit, and constructing a housing portion in which the electronic component is housed to be hermetically sealed.
1. An electronic component device comprising:
a silicon package unit including a silicon substrate, a through electrode provided in the silicon substrate, and an electrode post provided upright on an upper side of the silicon substrate and connected to the through electrode;
an electronic component mounted on the electrode post, and having a connection terminal connected to a top end of the electrode post; and
a cap package unit joined onto a periphery of the silicon package unit, and constructing a housing portion in which the electronic component is housed to be hermetically sealed.
2. The electronic component device according to claim 1 , wherein
the cap package unit is formed of a top plate and a frame-shaped silicon portion joined onto a periphery of a lower surface of the top plate, and
a lower part of the frame-shaped silicon portion is joined onto the silicon package unit.
3. The electronic component device according to claim 2 , wherein the top plate of the cap package unit is formed of any one of glass, silicon and ceramic.
4. The electronic component device according to claim 1 , wherein
the silicon package unit is provided with a concave portion in a central main portion thereof and a protruding joint portion on a periphery thereof,
the cap package unit is provided with a concave portion and a protruding joint portion corresponding to the concave portion and the protruding joint portion of the silicon package unit, respectively, and
the protruding joint portion of the cap package unit is joined onto the protruding joint portion of the silicon package unit.
5. The electronic component device according to claim 4 , wherein the cap package unit is formed of any one of glass, silicon and ceramic.
6. The electronic component device according to claim 1 , wherein
the electronic component is constructed by mounting an MEMS device on a semiconductor chip, and
the connection terminal disposed on a peripheral portion of the semiconductor chip is connected to the top end of the electrode post in a state that the MEMS device is arranged lower side.
7. The electronic component device according to claim 6 , wherein the MEMS device is connected to the semiconductor chip through a wire.
8. The electronic component device according to claim 1 , wherein the electrode post is formed of any one of copper and silicon.
9. The electronic component device according to claim 1 , further comprising a wiring pattern formed on the lower surface of the silicon package unit and connected to the through electrode.
10. The electronic component device according to claim 1 , wherein the height of the electrode post is within a range of 200 to 400 μm.