Flip chip mounting method by no-flow underfill
In a flip shop mounting method by a no-flow underfill in which resin is pre-coated on a substrate 52 , and, thereafter, a semiconductor 50 with bump is mounted on the substrate 52 to join a pad electrode 53 on the substrate 52 to the bump 51 , a resin 54 a highly filed with the filler 55 is applied to a region except for the pad electrode 53 on the substrate 52 , a resin 54 b being free from the filler is applied to a pad electrode 53 portion on the substrate 52 , and, thereafter, the semiconductor 50 with bump is mounted at a predetermined position on the substrate 52.
1. A flip chip mounting method by a no-flow underfill in which a resin is pre-coated on a substrate, and, thereafter, a semiconductor with bump is mounted on the substrate to join a pad electrode on the substrate to the bump, wherein
a resin highly filled with the filler is applied to a region except for the pad electrode on the substrate, a resin being free from the filler is applied to the pad electrode portion on the substrate, and, thereafter, the semiconductor with bump is mounted at a predetermined position on the substrate.