Sample dimension measuring method and scanning electron microscope
View Patent ↗An object of the present invention is to suppress measurement errors caused by the fact that the shrink amount due to scan of an electron beam differs pattern by pattern. To accomplish this object, according to the invention, functions indicative of a process of change of pattern dimension when the electron beam is irradiated on a sample are prepared in respect of the kinds of sample patterns, and dimension values of a particular pattern measured by scanning the electron beam on the particular pattern are fitted to a function prepared for the particular pattern to calculate a dimension of the particular pattern before it changes.
1. A sample dimension measuring method for scanning an electron beam on a sample and measuring dimensions of patterns formed on said sample based on detection of electrons emitted from scanned sites, the method comprising steps of:
measuring the patterns at a plurality of different sites a plurality of times to obtain a plurality of measurements;
calculating a mean value of variance calculated based on a difference between measured value data in the plurality of measurements and a curve representative of a reduction of the measured value data with an increase of the number of measurements, so that the curve is formed to make the mean value of variance small;
storing the formed curve with respect to each type of pattern; and
measuring a dimension of each of pattern before reduction in dimension, based on the stored curve.
2. A sample dimension measuring method according to claim 1 , wherein the sample to be used for forming the curve is a wafer to be measured in the dimension measuring step and a calibration wafer having a common pattern.
3. A scanning electron microscope comprising:
an electron source;
a focusing lens for focusing an electron beam emitted from said electron source;
a scan deflector for scanning said electron beam on a sample;
a detector for detecting electrons emitted from said sample; and
an operation unit for measuring dimensions of patterns on said sample based on an output of said detector,
wherein said operation unit includes a storage medium for storing measured value data obtained when patterns at a plurality of sites on said sample are measured a plurality of times to obtain a plurality of measurements,
wherein said operation unit calculates mean value of variance calculated based on a difference between the measured value data in the plurality of measurements and a curve representative of a reduction of the measured value data with an increase of the number of measurements so that the curve is formed to make the mean value of variance small, and
wherein said operation unit stores the formed curve with respect to each type of pattern and measures a dimension of each pattern before reduction in dimension based on the stored curve.
4. A scanning electron microscope according to claim 3 , wherein said operation unit calculates the variance among the plurality of measurements, based on a difference between the measured value data at the plurality of sites and the data determined by the curve.
5. A scanning electron microscope according to claim 4 , wherein said operation unit calculates a coefficient of the function curve in which the variance is minimized.
6. A scanning electron microscope according to claim 4 , wherein said operation unit calculates the variance with respect to each of the plurality of sites and determines the curve so that the mean value of the variance is minimized.
7. A scanning electron microscope according to claim 3 , wherein the operation unit determines the coefficient of the curve so that a value calculated by the curve is most approximate to the measured value data.