IP Library Granted Patent US 7,999,456
Granted Patent B2
US 7,999,456 · App. 11/905,234 · Granted Aug 16, 2011

White light emitting diode with yellow, green and red light emitting phosphor

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Quick Facts
Patent No.
US 7,999,456
App. No.
11/905,234
Granted
Aug 16, 2011
Kind
B2
Abstract

Provided is a white light emitting diode (LED) including a blue LED chip; and yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light.

Claims (11)

1. A white light emitting diode (LED) comprising:

a blue LED chip; and

yellow, green, and red light emitting phosphors that are coated on the blue LED chip at a predetermined mixing ratio and converts light, emitted from the blue LED chip, into white light;

wherein the yellow light emitting phosphor is a silicate-based phosphor,

wherein the green light emitting phosphor is a silicate-based phosphor composed of (Ba, Sr, Ca, Mg)2SiO4:Eu, Re or a sulfide-based phosphor composed of (Sr, Ca)Ga2S4:Eu, Re

wherein the red light emitting phosphor is a nitride-based phosphor composed of Sr, Ca, Ba)AlSiN:Eu, Re

wherein the Eu represents a basic doping, Re represents rare earth co-doping and the mixing ratio of the yellow, green, and red light emitting phosphors is set in the range of: 0.5≦yellow light emitting phosphors <1, 0.01≦green light emitting phosphors ≦0.04, and 0.01<red light emitting phosphors ≦0.1 (here, yellow light emitting phosphors+green light emitting phosphors+red light emitting phosphors=1).

2. The white LED according to claim 1 , wherein the yellow, green, and red light emitting phosphors are mixed and scattered.

3. The white LED according to claim 1 , wherein the yellow, green, and red light emitting phosphors are sequentially laminated in the form of layer.

4. The white LED according to claim 1 , wherein the yellow, green, and red light emitting phosphors are mixed with a molding material and are then coated.

5. The white LED according to claim 4 , wherein the molding material is formed of any one selected from the group consisting of silicon, hybrid, epoxy, and polyvinyl-based resin.

Assignments (4)
MERGER Recorded Aug 7, 2012
From: SAMSUNG LED CO., LTD.
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 028744/0272 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 12, 2010
From: SAMSUNG ELECTRO-MECHANICS CO., LTD.
To: SAMSUNG LED CO., LTD.
Reel/Frame 024375/0448 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THIRD INVENTOR NAME PREVIOUSLY RECORDED ON REEL 019949 FRAME 0629. ASSIGNOR(S) HEREBY CONFIRMS THE THIRD INVENTOR NAME SHOULD BE CHANG HOON KWAK. Recorded Dec 19, 2007
From: SOHN, JONG RAK; YOON, CHUL SOO; KWAK, CHANG HOON; PARK, IL WOO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 020269/0751 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2007
From: SOHN, JONG RAK; YOON, CHUL SOO; KWAK, SHANG HOON; PARK, IL WOO
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 019949/0629 →