Semiconductor device
View Patent ↗In a semiconductor device such as a high-frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate. In order to make the high-frequency power amplifier module small in size, a substrate-side bonding electrode electrically connected to a wire set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate-side output electrode electrically connected to an output wire. A substrate-side input electrode electrically connected to an input wire is located at a distance from the side of the semiconductor chip about equal to the distance from the side of the semiconductor chip to the substrate-side output electrode, or at a location farther from the side of the semiconductor chip than the substrate-side bonding electrode is.
1. An RF power amplifier module including a power amplifier circuit, said RF power amplifier module comprising:
a semiconductor chip having a main surface, said main surface being quadrilateral and having a pair of first sides and a pair of second sides perpendicular to the first sides;
a mounting substrate having a mounting surface over which said semiconductor chip is mounted;
an input stage transistor having a first input node and a first output node, disposed on the main surface of the semiconductor chip;
an intermediate stage transistor having a second input node and a second output node, disposed on the main surface of the semiconductor chip, said first output node being electrically coupled to the second input node;
an output stage transistor having a third input node and a third output node, disposed on the main surface of the semiconductor chip, said second output node being electrically coupled to the third input node, said input stage, intermediate stage and output stage transistors comprising the power amplifier circuit;
an input terminal disposed on the mounting surface of the mounting substrate;
an output terminal disposed on the mounting surface of the mounting substrate;
an input bonding wire electrically coupling the input terminal and the first input node, said input bonding wire being disposed so as to cross over one of the first sides of the main surface of the semiconductor chip; and
an output bonding wire electrically coupling the output terminal and the third output node, said output bonding wire being disposed so as to cross over one of the second sides of the main surface of the semiconductor chip.
2. An RF power amplifier module according to claim 1 , wherein the input terminal is disposed along the one first side of the main surface of the semiconductor chip.
3. An RF power amplifier module according to claim 1 , wherein the output terminal is disposed along the one second side of the main surface of the semiconductor chip.
4. An RF power amplifier module according to claim 1 , wherein the input stage, intermediate stage and output stage transistors are hetero-junction bipolar transistors (HBT).
5. An RF power amplifier module according to claim 1 , wherein a capacitive element and a resistive element are disposed on the mounting surface of the mounting substrate; and
said capacitive element and a resistive element are electrically coupled to the input terminal.
6. An RF power amplifier module according to claim 1 , wherein a capacitive element and a resistive element are disposed on the mounting surface of the mounting substrate; and
said capacitive element and resistive element are electrically coupled to the output terminal.
7. An RF power amplifier module according to claim 1 , wherein the mounting substrate has a back surface opposite to the mounting surface;
a plurality of external electrodes are disposed on the back surface;
one of the external electrodes is electrically coupled to the input terminal; and
another one of the external electrodes is electrically coupled to the output terminal.
8. An RF power amplifier module according to claim 1 , wherein the mounting substrate is comprised of laminated insulating layers.
9. An RF power amplifier module including a power amplifier circuit, said RF power amplifier module comprising:
a semiconductor chip having a main surface;
a mounting substrate having a mounting surface over which said semiconductor chip is mounted;
an input stage transistor having a first input node and a first output node, disposed on the main surface of the semiconductor chip;
an intermediate stage transistor having a second input node and a second output node, disposed on the main surface of the semiconductor chip, said first output node being electrically coupled to the second input node;
an output stage transistor having a third input node and a third output node, disposed on the main surface of the semiconductor chip, said second output node being electrically coupled to the third input node, said input stage, intermediate stage and output stage transistors comprising the power amplifier circuit;
an input terminal disposed on the mounting surface of the mounting substrate;
an output terminal disposed on the mounting surface of the mounting substrate;
an input bonding wire electrically coupling the input terminal and the first input node; and
an output bonding wire electrically coupling the output terminal and the third output node.
10. An RF power amplifier module according to claim 9 , wherein the input terminal is disposed along the one first side of the main surface of the semiconductor chip.
11. An RF power amplifier module according to claim 9 , wherein the output terminal is disposed along the one second side of the main surface of the semiconductor chip.
12. An RF power amplifier module according to claim 9 , wherein the input stage, intermediate stage and output stage transistors are hetero-junction bipolar transistors (HBT).
13. An RF power amplifier module according to claim 9 , wherein a capacitive element and a resistive element are disposed on the mounting surface of the mounting substrate; and
said capacitive element and a resistive element are electrically coupled to the input terminal.
14. An RF power amplifier module according to claim 9 , wherein a capacitive element and a resistive element are disposed on the mounting surface of the mounting substrate; and
said capacitive element and resistive element are electrically coupled to the output terminal.
15. An RF power amplifier module according to claim 9 , wherein the mounting substrate has a back surface opposite to the mounting surface;
a plurality of external electrodes are disposed on the back surface;
one of the external electrodes is electrically coupled to the input terminal; and
another one of the external electrodes is electrically coupled to the output terminal.
16. An RF power amplifier module according to claim 9 , wherein the mounting substrate is comprised of laminated insulating layers.