IP Library › Assignment 027558/0846
Patent Assignment
Reel/Frame 027558/0846

Assignment of Assignor's Interest

Recorded: 2012-01-19 Pages: 5
Assignor
Assignee
RENESAS ELECTRONICS CORPORATION
1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, KANAGAWA, JAPAN
Covered Properties (8)
Semiconductor Device
Patent: 6,330,165 →
Application: 09/345,505 →
Semiconductor Device
Patent: 6,489,680 →
Application: 09/970,668 →
Publication: US 2002/0015291
Semiconductor Device
Patent: 6,943,441 →
Application: 10/291,840 →
Publication: US 2003/0102574
High Frequency Power Amplifier Module and Wireless Communication System
Patent: 6,897,728 →
Application: 10/614,015 →
Publication: US 2004/0012445
Semiconductor Device
Patent: 7,068,521 →
Application: 11/194,701 →
Publication: US 2005/0269590
Semiconductor Device
Patent: 7,525,813 →
Application: 11/905,421 →
Publication: US 2008/0048777
Semiconductor Device
Patent: 7,817,437 →
Application: 12/394,421 →
Publication: US 2009/0161329
Semiconductor Device
Patent: 8,295,057 →
Application: 12/787,154 →
Publication: US 2010/0231304
Related Assignments (6)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 18, 2010
From: HITACHI, LTD.
To: RENESAS TECHNOLOGY CORP.
Reel/Frame 024091/0633 →
Merger and Change of Name Jul 29, 2010
From: RENESAS TECHNOLOGY CORP.
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 024755/0338 →
Change of Name Jan 19, 2012
From: HITACHI TOHBU SEMICONDUCTOR, LTD.
To: EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
Reel/Frame 027558/0488 →
Change of Name Jan 19, 2012
From: EASTERN JAPAN SEMICONDUCTOR TECHNOLOGIES, INC.
To: RENESAS EASTERN JAPAN SEMICONDUCTOR, INC.
Reel/Frame 027558/0681 →
Assignment of Assignor's Interest Mar 21, 2012
From: RENESAS ELECTRONICS CORPORATION
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 027898/0663 →
Assignment of Assignor's Interest Mar 28, 2012
From: RENESAS ELECTRONICS CORPORATION
To: MURATA MANUFACTURING CO., LTD.
Reel/Frame 027946/0388 →