Chemical mechanical polishing apparatus
View Patent ↗An edge section of a wafer can be polished, and at same time, a polishing surface of a polishing member can be dressed by a dresser mechanism. A polishing member has annular concave trenches, which are coaxially formed in the front surface thereof, and at least an inner surface of the concave trenches is composed of an inclined polishing surface for polishing an edge section of the wafer, and a wafer pressing mechanism presses the edge section of the wafer against the inner surfaces in at least one side of the concave trench of the polishing member, and a dresser mechanism dresses at least the inner surfaces in at least one side of the concave trench of the polishing member.
1. A chemical mechanical polishing (CMP) apparatus for polishing an edge section of a boundary between a front surface and a circumference surface of a disc-shaped wafer, comprising:
a disc-shaped polishing member rotatably supported by a shaft;
a wafer pressing mechanism for retaining said wafer and pressing said wafer against said polishing member; and
a dresser mechanism for dressing said polishing member at a location, which is different from a location where said wafer pressing mechanism presses said wafer,
wherein said polishing member includes at least one annular concave trench coaxially formed on a front surface of said polishing member,
wherein at least one inner surface of said concave trench is composed of an inclined polishing surface for polishing an edge section of said wafer, said wafer pressing mechanism pressing the edge section of said wafer against at least one inner surface of said concave trench of said polishing member, and
wherein said dresser mechanism dresses the inner surface of said concave trench, against which said edge section of said polishing member is pressed.
2. The CMP apparatus as set forth in claim 1 , further comprising a plurality of said wafer pressing mechanisms for of pressing said plurality of wafers against a plurality of locations in said polishing member, respectively.
3. The CMP apparatus as set forth in claim 1 , wherein said polishing member includes a disc-shaped turn table and a CMP pad mounted on a front surface of said turn table, and wherein a front surface of said turn table is formed to have a geometry, by which said CMP pad forms said concave trench.
4. The CMP apparatus as set forth in claim 1 , wherein said polishing member includes a disc-shaped turn table, a pad jig mounted on a front surface of said turn table, and a CMP pad mounted on a front surface of said pad jig, and wherein a front surface of said pad jig is formed to have a geometry, by which said CMP pad forms said concave trench.
5. The CMP apparatus as set forth in claim 1 , wherein said polishing member has a disc-shaped turn table and a CMP pad mounted on a front surface of said turn table, and wherein said concave trench is formed in a front surface of said CMP pad.
6. The CMP apparatus as set forth in claim 1 , wherein said wafer pressing mechanism presses an edge section of said wafer against said inner surface in both sides of said concave trench of said polishing member, and wherein said dresser mechanism dresses at least said inner surface in both sides of said concave trench of said polishing member.
7. The CMP apparatus as set forth in claim 1 , wherein said wafer pressing mechanism rotatably supports said wafer by a shaft while said wafer is inclined relative to said polishing member, and is capable of pressing said edge section against said polishing member.