Patent Assignment
Reel/Frame 025235/0233
Change of Name
Recorded: 2010-11-02
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Semiconductor Device
Method and Appratus of Manufacturing Semiconductor Device
Semiconductor Device with Decoupling Capacitance Controlled and Control Method for the Same
Method of Producing a Semiconductor Device Having a Trench-Stuffed Layer
Semiconductor Device
Method of Manfacturing Semiconductor Device
Application:
11/853,038 →
Publication:
US 2008/0285006
Semiconductor Device
Annealing Apparatus, Annealing Method, and Method of Manufacturing a Semiconductor Device
Application:
11/853,183 →
Publication:
US 2008/0064128
Semiconductor Apparatus
Semiconductor Device and Method of Manufacturing the Same
Application:
11/854,183 →
Publication:
US 2008/0087949
Electronic Device and Method of Manufacturing the Same
Method of Manufacturing Semiconductor Device
Semiconductor Integrated Circuit Device Having a Decoupling Capacitor
Semiconductor Device and Method of Manufacturing the Same
Key Input Device and Key Scan Method
Electronic Device and Method of Manufacturing the Same
Electronic Device and Method of Manufacturing the Same
Drive Circuit of Display Apparatus
Dram and Sram Mixedly Mounted Semiconductor Device
Method of Designing a Pattern
Matrix Switch
Error Correction Code Decoding Device
Semiconductor Memory Device
Modulation Circuit Having Dc Offset Level Control Circuit
Semiconductor Device and Method of Manufacturing Same
Application:
11/872,797 →
Publication:
US 2008/0160686
Semiconductor Device and Method of Manufacturing Semiconductor Device
Application:
11/874,223 →
Publication:
US 2008/0093716
Semiconductor Integrated Circuit Controlling Output Impedance and Slew Rate
Electronic Device and Method of Manufacturing the Same
Application:
11/876,936 →
Publication:
US 2008/0094815
Cache Memory Having Pipeline Structure and Method for Controlling the Same
Semiconductor Device and Method for Manufacturing Same
Interface Circuit
Systolic Array
Apparatus for editing data stream
Application:
11/878,225 →
Publication:
US 2008/0019664
Information processing apparatus and information processing method
Application:
11/878,575 →
Publication:
US 2008/0024665
Level Converter and Semiconductor Device
Electrochemical processing apparatus and method of processing a semiconductor device
Application:
11/882,177 →
Publication:
US 2008/0029402
Semiconductor Memory Device and Semiconductor Memory Device Control Method
Semiconductor Device Comprising an Excess Resin Portion, Manufacturing Method Thereof, and Apparatus for Manufacturing Semiconductor Device Comprising a Excess Resin Portion
Temperature Detection Circuit and Semiconductor Device
Driver Circuit and Method of Controlling the Same
Semiconductor Integrated Circuit Device Having Latchup Preventing Function
Semiconductor Device and Method of Manufacturing the Same
Data Processing Apparatus for Controlling Access to a Memory Based Upon Detection of Completion of a Dma Bus Cycle
Semiconductor Memory Device
Pattern for evaluating electric characteristics, method for evaluating electric characteristics, method for manufacturing semiconductor device and method for providing reliability assurance
Application:
11/889,267 →
Publication:
US 2008/0038851
Split gate nonvolatile memory and manufacturing method of the same
Application:
11/889,657 →
Publication:
US 2008/0042189
Display Panel Drive Technique for Reducing Power Consumption
Symbol Timing Detection Method and Apparatus, and Preamble Detection Method and Apparatus
Electronic Package and Semiconductor Device Using the Same
Semiconductor Memory Device
Semiconductor Memory Device
Switching Power Supply Unit and Control Method of Switching Power Supply Unit
Equalizer Circuit and Method of Controlling the Same
Adaptor and Wireless Communication Module
Constant Current Circuit
Method of Manufacturing a Semiconductor Device Having an Interconnect Structure That Increases in Impurity Concentration as Width Increases
Semiconductor Device and Manufacturing Method Thereof
Mobile terminal and display panel driver
Application:
11/892,924 →
Publication:
US 2008/0055231
Method of Manufacturing a Semiconductor Device That Includes Forming a via Hole Through a Reaction Layer Formed Between a Conductive Barrier and a Wiring
Soft Error Rate Calculation Method and Program, Integrated Circuit Design Method and Apparatus, and Integrated Circuit
Method and Apparatus for Designing Semiconductor Integrated Device Using Noise Current and Impedance Characteristics of Input/Output Buffers Between Power Supply Lines
Liquid crystal display device and drive circuit
Application:
11/896,915 →
Publication:
US 2008/0062341
A Semiconductor Device with an Opening for cutting a Fuse
Decoder Circuit, Driving Circuit for Display Apparatus and Display Apparatus
Polishing apparatus, polishing pad, and polishing method
Application:
11/898,211 →
Publication:
US 2008/0064302
Processing Data Supply Method and Image Processing Apparatus
Bus Driver Including Control Circuit for Overvoltage Protection
Pll Circuit
Semiconductor integrated circuit including a monitor unit
Application:
11/898,537 →
Publication:
US 2008/0072212
Pll Circuit
Semiconductor device
Application:
11/898,583 →
Publication:
US 2008/0067625
Driving Circuit and Data Driver of Planar Display Device
Temperature Detection Circuit
Access Control Method for a Memory, Memory Controller for Controlling Access to the Memory, and Data Processing Apparatus
Phase Shifting Circuit Having a Constant Phase Shift
Operational Amplifier and Method of Driving Liquid Crystal Display
Semiconductor Integrated Circuit
Selecting Circuit
Transmitter, Transmission Method, Receiver, Receiving Method, Communication Device, and Communication Method Including Generating an Individual Spread Code and Performing Spread Spectrum Processing
Macro-cell block and semiconductor device
Application:
11/902,745 →
Publication:
US 2008/0258292
Clock Distribution Circuit and Test Method
Semiconductor Integrated Circuit, Bist Circuit, Design Program of Bist Circuit, Design Device of Bist Circuit and Test Method of Memory
Semiconductor Device and Method for Manufacturing Same
Semiconductor integrated
Application:
11/902,913 →
Publication:
US 2008/0074176
Communication Apparatus and Communication System
Receiver circuit
Application:
11/902,916 →
Publication:
US 2008/0075473
Method of Manufacturing Semiconductor Apparatus
Method of driving a display device to drive plural pixels in a time-division manner and the display device
Application:
11/905,362 →
Publication:
US 2008/0079703
Differential Amplifier Circuit
Chemical Mechanical Polishing Apparatus
Signal Transmission Circuit
Esd Analysis Device and Esd Analysis Program Used for Designing Semiconductor Device and Method of Designing Semiconductor Device
Related Assignments
(19)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Aug 29, 2007
From: SHIRATANI, MASAFUMI; MORITA, TOMOTAKE
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019763/0334 →
Assignment of Assignor's Interest
Aug 29, 2007
From: KUMAGAI, HOKUTO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019761/0012 →
Assignment of Assignor's Interest
Sep 5, 2007
From: NINOMIYA, HITOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019784/0779 →
Assignment of Assignor's Interest
Sep 6, 2007
From: OHNO, AKIO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019787/0951 →
Assignment of Assignor's Interest
Sep 6, 2007
From: UMAMICHI, TAKASHI; SHIRAI, KATSUNORI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019788/0320 →
Assignment of Assignor's Interest
Sep 11, 2007
From: UCHIDA, SHINICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019806/0836 →
Assignment of Assignor's Interest
Sep 11, 2007
From: MATSUBARA, YOSHIHISA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019806/0444 →
Assignment of Assignor's Interest
Sep 17, 2007
From: ASAI, SHUJI; KUROSAWA, NAOTO; OIKAWA, HIROKAZU; NIWA, TAKAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019833/0084 →
Assignment of Assignor's Interest
Sep 17, 2007
From: MARUOKA, MICHIAKI; HAMADA, KIMIMORI; TAKAYA, HIDEFUMI
To: NEC ELECTRONICS CORPORATION; TOYOTA JIDOSHA KABUSHIKI KAISHA
Reel/Frame 019832/0634 →
Assignment of Assignor's Interest
Sep 17, 2007
From: ISHIGAKI, HIROKAZU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019832/0723 →
Assignment of Assignor's Interest
Sep 18, 2007
From: KURITA, YOICHIRO; SOEJIMA, KOJI; KAWANO, MASAYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019837/0823 →
Assignment of Assignor's Interest
Sep 21, 2007
From: SUZUKI, TATSUYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019862/0273 →
Assignment of Assignor's Interest
Sep 25, 2007
From: HASEGAWA, KOICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019870/0449 →
Assignment of Assignor's Interest
Oct 2, 2007
From: KURITA, YOICHIRO; KAWANO, MASAYA; SOEJIMA, KOJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019905/0282 →
Assignment of Assignor's Interest
Oct 2, 2007
From: KURITA, YOICHIRO; SOEJIMA, KOJI; KAWANO, MASAYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019905/0489 →
Assignment of Assignor's Interest
Oct 5, 2007
From: TOGASHI, MASAHIRO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019925/0902 →
Re-Record to Correct the Address of the Assignee, Previously Recorded on Reel 019787 Frame 0951.
Nov 1, 2007
From: OHNO, AKIO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020058/0227 →
Corrective Assignment to Correct the Address of the Assignee Previously Recorded on Reel 019870 Frame 0449. Assignor(S) Hereby Confirms the Correct Address Is 1753 Shimonumabe, Nakahara-Ku, Kawasaki, Kanagawa, 211-8668, Japan.
Aug 7, 2009
From: HASEGAWA, KOICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 023067/0330 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →