IP Library Granted Patent US 7,825,529
Granted Patent B2
US 7,825,529 · App. 11/905,988 · Granted Nov 2, 2010

Semiconductor device and display device having alignment mark

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Quick Facts
Patent No.
US 7,825,529
App. No.
11/905,988
Granted
Nov 2, 2010
Kind
B2
Abstract

A semiconductor device includes a semiconductor substrate and an alignment mark. The alignment mark is provided on the semiconductor substrate and optically detectable. The alignment mark includes a bright area and a dark area. The bright area outputs light reflected from a surface of the semiconductor substrate. The dark area includes metal wirings, outputs light reflected from surfaces of the metal wirings, and has brightness lower than that of the bright area.

Claims (50)

1. A semiconductor device, comprising:

a semiconductor substrate; and

an alignment mark provided on said semiconductor substrate and being optically detectable,

wherein said alignment mark includes:

a bright area to output light reflected from a surface of said semiconductor substrate, and

a dark area that includes metal wirings, having a flat surface, to output light reflected from surfaces of said metal wirings, said dark area having a brightness lower than that of said bright area.

2. The semiconductor device according to claim 1 , wherein said dark area includes:

antireflection films formed on said surfaces of said metal wirings, respectively, and

wherein said light reflected from said surfaces of said metal wirings is outputted through said antireflection films.

3. The semiconductor device according to claim 1 , wherein said metal wirings are formed in a fine pattern in which fine shapes are arranged at predetermined intervals.

4. The semiconductor device according to claim 3 , wherein said fine pattern is one of a stripe pattern, a dot pattern, a grid pattern, and a spiral pattern.

5. The semiconductor device according to claim 1 , further comprising:

a circuit formed on said semiconductor substrate which includes circuit elements,

wherein said metal wirings are formed in a layer same as a wiring layer in which circuit metal wirings connected to said circuit elements are formed.

6. The semiconductor device according to claim 5 , wherein said metal wirings comprise a material same as that of said circuit metal wirings.

7. The semiconductor device according to claim 1 , wherein said metal wirings includes polysilicon gates, and

wherein said dark area includes an area in which said light reflected from said surfaces of said polysilicon gates is outputted.

8. The semiconductor device according to claim 1 , wherein said dark area includes:

a first wiring layer that includes said metal wirings, and

a second wiring layer formed on or under said first wiring layer, and includes second metal wirings,

wherein said dark area outputs said light reflected from said surfaces of said metal wirings and light reflected from surfaces of said second metal wirings.

9. The semiconductor device according to claim 8 , wherein said dark area includes:

second antireflection films formed on said surfaces of said second metal wirings, respectively,

wherein said light reflected from said surfaces of said second metal wirings is outputted through said second antireflection films.

10. A display device, comprising:

a semiconductor device; and

a transparent substrate configured to mount said semiconductor device,

wherein said semiconductor device includes:

a semiconductor substrate; and

an alignment mark provided on said semiconductor substrate and being optically detectable, and

wherein said alignment mark comprises:

a bright area to output light reflected from a surface of said semiconductor substrate, and

a dark area that includes metal wirings, having a flat surface, to output light reflected from surfaces of said metal wirings, said dark area having a brightness lower than that of said bright area.

11. The display device according to claim 10 , wherein said dark area includes:

antireflection films formed on said surfaces of said metal wirings, respectively, and

wherein said light reflected from said surfaces of said metal wirings is outputted through said antireflection films.

12. The display device according to claim 10 , wherein said metal wirings are formed in a fine pattern in which fine shapes are arranged at predetermined intervals.

13. The display device according to claim 12 , wherein said fine pattern is one of a stripe pattern, a dot pattern, a grid pattern, and a spiral pattern.

14. The display device according to claim 10 , wherein said semiconductor device further includes:

a circuit area configured to be formed on said semiconductor substrate and include circuit elements, and

wherein said metal wirings is formed in a layer same as a wiring layer in which circuit metal wirings connected to said circuit elements are formed.

15. The display device according to claim 14 , wherein said metal wirings comprise a material same as that of said circuit metal wirings.

16. The display device according to claim 10 , wherein said metal wirings includes polysilicon gates, and

wherein said dark area includes an area in which said light reflected from said surfaces of said polysilicon gates is outputted.

17. The display device according to claim 10 , wherein said dark area includes:

a first wiring layer includes said metal wirings, and

a second wiring layer formed on or under said first wiring layer that includes second metal wirings, and

wherein said dark area outputs said light reflected from said surfaces of said metal wirings and light reflected from surfaces of said second metal wirings.

18. The semiconductor device according to claim 1 , wherein said metal wirings are provided other than in the bright area.

19. The display device according to claim 10 , wherein said metal wirings are provided other than in the bright area.

Assignments (3)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
CHANGE OF NAME Recorded Nov 2, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025235/0321 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 10, 2008
From: HORII, HIDEAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020370/0251 →