Patent Assignment
Reel/Frame 025235/0321
Change of Name
Recorded: 2010-11-02
Pages: 9
Assignor
NEC ELECTRONICS CORPORATION
Executed: 2010-04-01
Assignee
RENESAS ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU,, KAWASAKI-SHI, KANAGAWA, 211-8668, JAPAN
Covered Properties
(92)
Wiring board
Application:
11/905,721 →
Publication:
US 2008/0083984
Display device and display panel driver using grayscale voltages which correspond to grayscales
Application:
11/905,812 →
Publication:
US 2008/0100646
Small Size Power Amplifier with Amplifiers Switched
Semiconductor Device and Display Device Having Alignment Mark
Semiconductor Integrated Circuit and Control Method Thereof
Semiconductor Integrated Circuit with Leakage Current Suppressed
Semiconductor Integrated Circuit Device
Semiconductor Memory with a Delay Circuit
Drive Circuit of Display Device and Method of Testing the Same
Decoding Device and Decoding Method
Circuit Designing Program and Circuit Designing System Having Function of Test Point Insertion
Semiconductor integrated circuit device
Application:
11/907,896 →
Publication:
US 2008/0094381
Voltage-Booster Power Supply Circuit
Multilayer Wiring Structure, Semiconductor Device, Pattern Transfer Mask and Method for Manufacturing Multilayer Wiring Structure
Phase Shifter Having Components Which Suppress Fluctuations in the Phase Shifter Pass Characteristics
Semiconductor Integrated Circuit Capable of Autonomously Adjusting Output Impedance
Control Method for an Information Processing Device
Application:
11/925,101 →
Publication:
US 2008/0307470
Image Sensor
Semiconductor Integrated Circuit Device Including Charge Pump Circuit Capable of Suppressing Noise
Charge Pump Circuit with Reduced Parasitic Capacitance
Method for Fabricating a Metal-Insulator-Metal (Mim) Capacitor Having Capacitor Dielectric Layer Formed by Atomic Layer Deposition (Ald)
Magnetron Sputtering Apparatus
Application:
11/928,506 →
Publication:
US 2008/0149473
Failure Diagnosis for Logic Circuits
Semiconductor Device Package of Stacked Semiconductor Chips with Spacers Provided Therein
Semiconductor Device and Audio Processor Chip
Field Effect Transistor and Semiconductor Device, and Method for Manufacturing Same
Application:
11/935,432 →
Publication:
US 2008/0105910
Semiconductor Device and Memory
Transistor and Method for Manufacturing Same
Semiconductor Device and Method for Manufacturing Same
Method for Manufacturing Semiconductor Device
Removing Solution, Cleaning Method for Semiconductor Substrate, and Process for Production of Semiconductor Device
Solid-State Imaging Apparatus
Heterojunction Bipolar Transistor
Semiconductor Device
Semiconductor Device and Method of Fabricating the Same
Semiconductor Device and Method of Manufacturing the Same
Electro-Static Discharge Protection Device
Fuse Structure for Semiconductor Integrated Circuit with Improved Insulation Film Thickness Uniformity and Moisture Resistance
Semiconductor Device
Application:
11/947,810 →
Publication:
US 2008/0128881
Semiconductor Manufacturing Apparatus and Semiconductor Manufacturing Method
Semiconductor Integrated Circuit Device Featuring Processed Minimum Circuit Pattern, and Design Method Therefor
Semiconductor Device, Wafer and Method of Designing and Manufacturing the Same
Semiconductor Device with Bonding Pad Support Structure
Method of Manfacturing Semiconcudtor Device
Semiconductor Device with Improved Source and Drain and Method of Manufacturing the Same
Application:
11/954,835 →
Publication:
US 2008/0142885
Semiconductor Storage Device, Semiconductor Device, and Manufacturing Method Therefor
Simulation Method, Simulation System, and Method of Correcting Mask Pattern
Application:
11/956,439 →
Publication:
US 2008/0145769
Mask Data Generation Method, Mask Formation Method, Pattern Formation Method
Application:
11/959,610 →
Publication:
US 2008/0148218
Method of Making a Multi- Layered Semiconductor Device
Semiconductor Device and Method of Manufacturing the Same
Method of Manufacturing Semiconductor Device
Application:
11/964,074 →
Publication:
US 2008/0214008
Method of Evaluating a Film
Multi-Band Rf Receiver
Application:
11/966,481 →
Publication:
US 2010/0048155
Linear Image Sensor
Laser Beam Processing Method for Making a Semiconductor Device
Semiconductor Device and Method for Manufacturing Same
Device for Releasing Heat Generated in the Amplifier Unit of a Solid-State Image Sensing Element
Display Driver Ic Having Embedded Dram
Application:
11/971,219 →
Publication:
US 2008/0186303
Display Driver Ic Having Embedded Memory
Application:
11/971,222 →
Publication:
US 2008/0186266
Light Receiving Circuit Having Two Switched Photodiodes
Semiconductor Device and Method of Manufacturing the Same
Display Driver Ic Having Embedded Dram
Application:
11/971,926 →
Publication:
US 2008/0186335
Semiconductor Device and Method for Manufacturing Same
Driving method of liquid crystal display apparatus and driving circuit of the same
Application:
11/976,160 →
Publication:
US 2008/0100603
Semiconductor Apparatus and Method of Manufacturing the Same
Bandpass filter circuit
Display Apparatus, Data Driver and Method of Driving Display Panel
Semiconductor Memory Device Having Write Data Through Function
Operational Amplifier and Display Device
Multiphase Clock Generation Circuit
Parent terminal selection method and terminal having parent terminal selection function for use in star-type connection AD HOC wireless network
Application:
11/978,599 →
Publication:
US 2008/0101260
Data Driver and Display Device
Digital-To-Analog Converter Circuit, Data Driver, and Display Device Using the Digital-to-Analog Converter Circuit
Data Driver with Multilevel Voltage Generating Circuit, and Liquid Crystal Display Apparatus Including Layout Pattern of Resistor String of the Multilevel Generating Circuit
Voltage Supply Circuit
Optical transceiver module and method for manufacturing same
Application:
11/979,695 →
Publication:
US 2009/0010296
Hysteresis Characteristic Input Circuit Including Resistors Capable of Suppressing Penetration Current
Data Receiver Circuit, Data Driver, and Display Device
Output Circuit, and Data Driver and Display Device Using the Same
Data Driver and Display Device
Transmission Circuit and System for the Same
Microcomputer having security function for memory access and debugging method of the same
Application:
11/979,796 →
Publication:
US 2008/0115108
Wireless Communication Apparatus Having Equalizer
Method of manufacturing semiconductor device
Application:
11/979,798 →
Publication:
US 2008/0119054
Gradation potential generation circuit, data driver of display device and the display device
Application:
11/979,799 →
Publication:
US 2008/0122820
Frequency Control
Method of Manufacturing Semiconductor Device Having of Spacer Gate Structure
Semiconductor Wafer, Method of Manufacturing the Same, and Method of Manufacturing a Semiconductor Device
Current Mirror Circuit
Information processing device
Application:
11/980,625 →
Publication:
US 2008/0138047
Viterbi decoding method
Application:
11/980,658 →
Publication:
US 2008/0109710
Capacitive Load Driving Circuit, Method of Driving Capacitive Load, Method of Driving Liquid Crystal Display Device
Related Assignments
(22)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Oct 3, 2007
From: KAGAWA, TAKASHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019971/0491 →
Assignment of Assignor's Interest
Oct 4, 2007
From: SUZUKI, KENJI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019972/0231 →
Assignment of Assignor's Interest
Oct 10, 2007
From: SHIMOOKA, MASAAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019997/0125 →
Assignment of Assignor's Interest
Oct 10, 2007
From: YODA, KENICHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 019997/0121 →
Assignment of Assignor's Interest
Oct 15, 2007
From: ORIO, MASAO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020014/0183 →
Assignment of Assignor's Interest
Oct 15, 2007
From: TAZUKE, TOSHIKAZU
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020014/0484 →
Assignment of Assignor's Interest
Oct 16, 2007
From: NONAKA, JUNPEI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020019/0774 →
Assignment of Assignor's Interest
Oct 18, 2007
From: HIRATSUKA, HITOSHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020032/0525 →
Assignment of Assignor's Interest
Oct 18, 2007
From: TAHATA, TAKASHI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020029/0986 →
Assignment of Assignor's Interest
Oct 24, 2007
From: ATSUMO, TAKAO; MIZUTANI, HIROSHI; MIYA, TATSUYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020007/0443 →
Assignment of Assignor's Interest
Oct 26, 2007
From: TSUNAI, SHIRO; TAMIYA, KOSEI; KIKUCHI, TETSUO
To: NEC ELECTRONICS CORPORATION; OLYMPUS CORPORATION; OLYMPUS IMAGING CORP.
Reel/Frame 020022/0863 →
Assignment of Assignor's Interest
Oct 26, 2007
From: FUKUSHI, TETSUO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020019/0182 →
Assignment of Assignor's Interest
Oct 29, 2007
From: KANAYAMA, MASAYA
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020027/0864 →
Assignment of Assignor's Interest
Nov 7, 2007
From: OHTAKE, HIROTO; HAYASHI, YOSHIHIRO
To: NEC CORPORATION
Reel/Frame 020080/0884 →
Assignment of Assignor's Interest
Jan 10, 2008
From: HORII, HIDEAKI
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020370/0251 →
Assignment of Assignor's Interest
Jan 23, 2008
From: HARIMA, FUMIO
To: NEC ELECTRONICS CORPORATION
Reel/Frame 020429/0223 →
Assignment of Assignor's Interest
Jun 25, 2009
From: NEC ELECTRONICS CORPORATION; OLYMPUS CORPORATION; OLYMPUS IMAGING CORPORATION
To: OLYMPUS IMAGING CORPORATION
Reel/Frame 022868/0567 →
Corrective Assignment to Correct the Assignee Previously Recorded on Reel 022868 Frame 0567. Assignor(S) Hereby Confirms the Assignees Should Read Olympus Imaging Corporation and Nec Electronic Corporation.
Jul 16, 2009
From: NEC ELECTRONICS CORPORATION; OLYMPUS IMAGING CORPORATION; OLYMPUS CORPORATION
To: NEC ELECTRONICS CORPORATION; OLYMPUS IMAGING CORPORATION
Reel/Frame 022960/0266 →
Assignment of Assignor's Interest
Jun 11, 2010
From: NEC CORPORATION
To: NEC ELECTRONICS CORPORATION
Reel/Frame 024524/0463 →
Merger
May 1, 2015
From: OLYMPUS IMAGING CORPORATION
To: OLYMPUS CORPORATION
Reel/Frame 035543/0890 →
Change of Address
Jun 27, 2016
From: OLYMPUS CORPORATION
To: OLYMPUS CORPORATION
Reel/Frame 039344/0502 →
Change of Address
Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →