IP Library Patent Application 11979695
Patent Application
App. No. 11/979,695

Optical transceiver module and method for manufacturing same

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Quick Facts
Patent No.
US None
App. No.
11/979,695
Abstract

An optical transceiver module and a method for manufacturing thereof, which are adopted for providing a reduced manufacturing cost and an improved signal quality, are achieved. The optical transceiver module 1 includes a VCSEL 13 that is capable of emitting light; a thermoplastic resin layer 22 provided on the VCSEL 13 and transparent to the above-described light; a copper foil 21 , provided in the thermoplastic resin layer 22 and the resin layer, and having an opening 21 a that is transparent to light; a dimple 22 a , provided in a surface of the thermoplastic resin layer 22 in a side opposite to the VCSEL 13 ; and a lens provided in the dimple. The dimple 22 a is located above the opening 21 a.

Claims (25)

1 . An optical transceiver module, comprising:

an optical element receives or emits light;

a resin layer formed above said optical element, and transmits said light;

a conductive layer formed in said resin layer, and has an opening transmits said light;

a dimple presented in the opposite side of said optical element in said resin layer; and

a lens formed in said dimple, wherein said dimple is located above said opening.

2 . The optical transceiver module according to claim 1 ,

wherein said bottom surface of said dimple has a curved surface, and said surface of the side of said dimple has a convex shape.

3 . The optical transceiver module according to claim 1 ,

wherein a surface of the opposite side of said dimple of said lens has a convex shape.

4 . The optical transceiver module according to claim 1 ,

wherein said lens is formed by a high refractive index resin has a higher refractive index than polyimide resin.

5 . The optical transceiver module according to claim 1 ,

wherein maximum depth of said dimple is substantially equivalent to a depth of said opening.

6 . The optical transceiver module according to claim 1 ,

wherein said conductive layer is used as a transmission path of electrical signal received or transmitted by said optical element.

7 . The optical transceiver module as according to claim 6 ,

wherein said conductive layer makes up a strip line or a micro strip line.

8 . The optical transceiver module as according to claim 7 ,

wherein said conductive layer is a copper foil.

9 . A method for manufacturing the optical transceiver module, comprising:

preparing a resin layer has a dimple on the surface; and

forming said lens by dropping a liquid resin in said dimple of said resin layer.

10 . The method for manufacturing the optical transceiver module according to claim 9 ,

wherein said liquid resin has a higher refractive index than polyimide resin.

Assignments (2)
CHANGE OF NAME Recorded Nov 2, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025235/0321 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 7, 2007
From: SHIMADA, YASUHEI; MORIBAYASHI, SHIGERU; YAMAZAKI, TAKAO
To: NEC ELECTRONICS CORPORATION; NEC CORPORATION
Reel/Frame 020150/0177 →