Semiconductor device with bonding pad support structure
View Patent ↗A semiconductor device having bonding pads on a semiconductor substrate includes: an upper copper layer that is formed on the lower surface of the bonding pads with a barrier metal interposed and that has a copper area ratio that is greater than layers in which circuit interconnects are formed; and a lower copper layer that is electrically insulated from the upper copper layer and that is formed closer to the semiconductor substrate than the upper copper layer.
1. A semiconductor device, comprising:
a bonding pad on a semiconductor substrate;
an upper copper layer on a lower surface of said bonding pad with a barrier metal interposed; and
a lower copper layer closer to said semiconductor substrate than said upper copper layer;
wherein a copper area ratio of said lower copper layer under said bonding pad is lower than that of said upper copper layer,
wherein said lower copper layer is not electrically connected to said upper copper layer under said bonding pad and is constituted by a plurality of copper layers, and
wherein the copper area ratios of each copper layer of said lower copper layer are substantially the same.
2. A semiconductor device, comprising:
a bonding pad on a semiconductor substrate;
an upper copper layer on a lower surface of said bonding pad with a barrier metal interposed; and
a lower copper layer closer to said semiconductor substrate than said upper copper layer;
wherein a copper area ratio of said lower copper layer under said bonding pad is lower than that of said upper copper layer,
wherein said lower copper layer is not electrically connected to said upper copper layer under said bonding pad and is constituted by a plurality of copper layers, and
wherein dielectric films that are composed of a first material are interposed between each of the copper layers of said lower copper layer.
3. A semiconductor device according to claim 2 , wherein each of copper layers of said lower copper layer are constituted by a copper pattern that is embedded in a dielectric film that is composed of a second material having a lower relative dielectric constant than said first material, and wherein said second material is softer than said first material.
4. A semiconductor device according to claim 3 , wherein a dielectric film that is composed of said second material contains any one of: a SiOC film, a silicon carbide (SIC) film, a SIOF film, a porous silicon dioxide (SiO2) film, a porous SiOC film, and a ladder oxide film having a ladder-type hydrogenated siloxane.
5. A semiconductor device according to claim 2 , wherein dielectric films composed of a third material having a lower relative dielectric constant than said first material are interposed between each of the copper layers of said lower copper layer.
6. A semiconductor device according to claim 5 , wherein said third material is softer than said first material.
7. A semiconductor device according to claim 5 , wherein a dielectric film composed of said third material contains any one of; a SIOC film, a silicon carbide (SIC) film, a SiOF film, a porous silicon dioxide (Si02) film, a porous SiOC film, and a ladder oxide film having a ladder-type hydrogenated siloxane.
8. A semiconductor device, comprising:
bonding pads that are provided on a semiconductor substrate;
an upper copper layer that is formed on the lower surface of said bonding pads with a barrier metal interposed; and
a lower copper layer that is formed closer to said semiconductor substrate than said upper copper layer;
wherein said upper copper layer is electrically insulated from said lower copper layer, and the copper area ratio of said upper copper layer is greater than that of other copper layers that are formed as circuit interconnects on said semiconductor substrate.
9. A semiconductor device according to claim 8 , wherein the copper area ratio of said upper copper layer is at least 70%.
10. A semiconductor device according to claim 8 , wherein the planar dimensions of said bonding pads and said upper copper layer are substantially the same.
11. A semiconductor device according to claim 8 , wherein said upper copper layer is constituted by a plurality of copper layers.
12. A semiconductor device according to claim 11 , wherein the copper area ratios of each of the copper layers of said upper copper layer are the same.
13. A semiconductor device according to claim 11 , further comprising: interlevel dielectric films that are provided between each of the copper layers of said upper copper layer; and
via-plugs composed of copper that are embedded in said interlevel dielectric films; wherein each of the copper layers of said upper copper layer are connected by way of said via-plugs.
14. A semiconductor device according to claim 13 , wherein a copper layer pattern of the copper layer that is positioned uppermost in said upper copper layer and via-plugs that are connected to this copper layer pattern are embedded in a dielectric film that is composed of a first material.
15. A semiconductor device according to claim 8 , wherein the copper area ratio of said lower copper layer is at least 15% and not greater than 95%.
16. A semiconductor device according to claim 8 , wherein said lower copper layer is constituted by a plurality of copper layers.
17. A semiconductor device according to claim 16 , wherein the copper area ratios of each of the copper layers of said lower copper layer are the same.
18. A semiconductor device according to claim 16 , wherein dielectric films that are composed of said first material are interposed between each of the copper layers of said lower copper layer.
19. A semiconductor device according to claim 18 , wherein each of the copper layers of said lower copper layer is constituted by a copper pattern that is embedded in a dielectric film that is composed of a second material having a lower relative dielectric constant than said first material.
20. A semiconductor device according to claim 19 , wherein said second material is softer than said first material.
21. A semiconductor device according to claim 19 , wherein dielectric films composed of said second material contain any one of; a SiOC film, a silicon carbide (SiC) film, a SiOF film, a porous silicon dioxide (Si02) film, a porous SiOC film, and a ladder oxide film having a ladder-type hydrogenated siloxane.
22. A semiconductor device according to claim 18 wherein dielectric films Composed of a third material having a lower relative dielectric constant than said first material are interposed between each of the copper layers of said lower copper layer.
23. A semiconductor device according to claim 22 , wherein said third material is softer than said first material.
24. A semiconductor device according to claim 22 , wherein said dielectric films composed of said third material contain any one of: a SiOC film, a silicon carbide (SiC) film, a S1OF film, a porous silicon dioxide (Si02) film, a porous SiOC film, and a ladder oxide film having a ladder-type hydrogenated siloxane.
25. A semiconductor device according to claim 8 , further comprising: internal circuits that are provided on said semiconductor substrate; and auxiliary copper interconnects that is electrically connected to said internal circuits; wherein said auxiliary copper interconnects are electrically connected to a portion of said bonding pads by way of via-holes.