Patent Assignment
Reel/Frame 020211/0162
Assignment of Assignor's Interest
Recorded: 2007-12-07
Pages: 2
Assignor
ODA, NORIAKI
Executed: 2004-01-15
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property
(1)
Semiconductor Device with Bonding Pad Support Structure
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.