Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance
View Patent ↗When the film thickness of an insulating film on a fuse connected to a circuit is not uniform within a wafer surface, there was a problem that disconnection of the fuse might become insufficient due to the insufficient intensity of a laser or disconnection of even an adjacent fuse due to excessive laser irradiation might occur. Further, a problem also occurred that after disconnection of the fuse, moisture entered from exterior through the region in which the fuse has been disconnected, so that the quality of a film underlying the fuse was adversely affected. After a SiON film, a SiN film, and a SiO 2 film have been formed to cover the fuse in this stated order, etching is performed to the SiN film, which is an etching stopper film. The SiON film having a uniform and desired film thickness is thereby formed on the fuse.
1. A method of manufacturing a semiconductor device comprising the steps of:
forming a fuse directly on a silicon oxide film that is disposed on a semiconductor substrate;
forming a silicon oxide film including nitrogen to directly cover said fuse;
forming an etching stopper film directly on said silicon oxide film including nitrogen, said etching stopper film comprising a silicon nitride film;
forming an insulating film over said etching stopper film;
removing said insulating film at an area above said fuse; and
removing said etching stopper film at the area above said fuse to expose said silicon oxide film including nitrogen.
2. The method of manufacturing the semiconductor device according to claim 1 , wherein said silicon oxide film including nitrogen comprises SiON.
3. The method of manufacturing the semiconductor device according to claim 1 , wherein said etching stopper film comprises a SiCN film.
4. The method of manufacturing the semiconductor device according to claim 1 , wherein said etching stopper film has a film thickness of 30 to 100 nm.
5. A method of manufacturing a semiconductor device comprising the steps of:
forming a base insulating film disposed on a semiconductor substrate;
forming metal wiring in said base insulating film;
forming a fuse disposed on said base insulating film;
forming a first silicon oxide film including nitrogen to directly cover said fuse and said wiring;
forming an etching stopper film over said first silicon oxide film;
forming an insulating film over said etching stopper film;
removing said first silicon oxide film, said etching stopper film, and said insulating film formed above a part of said wiring;
forming a bonding pad connected to said wiring;
forming a second silicon oxide film including nitrogen to cover said bonding pad;
forming an organic film over said second silicon oxide film;
removing said organic film and said second silicon oxide film formed above an area of said bonding pad and also removing said organic film, said second silicon oxide film and said insulating film formed above an area said fuse; and
removing said etching stopper film formed on said part of said fuse.
6. The method of manufacturing the semiconductor device according to claim 5 , wherein said metal wiring comprises copper wiring.
7. The method of manufacturing the semiconductor device according to claim 5 , wherein said first silicon oxide film comprises SiON.
8. The method of manufacturing the semiconductor device according to claim 5 , wherein said second silicon oxide film comprises SiON.