IP Library Assignment 020178/0855
Patent Assignment
Reel/Frame 020178/0855

Assignment of Assignor's Interest

Recorded: 2007-11-30 Pages: 2
Assignor
SAKOH, TAKASHI
Executed: 2005-01-12
Assignee
NEC ELECTRONICS CORPORATION
1753 SHIMONUMABE, NAKAHARA-KU, KAWASAKI, KANAGAWA, 211-8668, JAPAN
Covered Property (1)
Fuse Structure for Semiconductor Integrated Circuit with Improved Insulation Film Thickness Uniformity and Moisture Resistance
Patent: 7,579,266 →
Application: 11/947,807 →
Publication: US 2008/0081454
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name Nov 2, 2010
From: NEC ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 025235/0321 →