Semiconductor device and method for manufacturing same
View Patent ↗In conventional semiconductor devices, an insufficient supply of the resin to the end portions of the components that should be encapsulated is caused, resulting in an insufficient permeation of the resin into gaps between the components and the substrate, causing a spreading resin-wet. A semiconductor device 1 includes a mounting interconnect substrate 10 , a semiconductor chip 20 mounted on the mounting interconnect substrate 10 , an underfill resin 30 provided in a gap between the mounting interconnect substrate 10 and the semiconductor chip 20 and a flow-inducing section 40 provided in vicinity of the semiconductor chip 20 on the mounting interconnect substrate 10 and being capable of inducing a flow of the underfill resin 30 to the gap.
1. A semiconductor device, comprising:
a first electronic component;
a second electronic component mounted on said first electronic component;
an underfill resin provided in a gap between said first and said second electronic components; and
a flow-inducing section provided in vicinity of said second electronic component on said first electronic component, said flow-inducing section being capable of inducing a flow of said underfill resin into said gap,
wherein said flow-inducing section has a two-dimensional geometry that is equivalent to a portion of a circle, and wherein an open-circuit of said flow-inducing section is oriented toward said second electronic component.
2. The semiconductor device as set forth in claim 1 , wherein a solder resist is provided on said first electronic component, and said flow-inducing section is formed as an opening of said solder resist.
3. The semiconductor device as set forth in claim 2 , wherein said opening reaches to said gap.
4. The semiconductor device as set forth in claim 2 , further comprising a protruding portion provided in a circumference portion of said opening in a side opposite to said second electronic component.
5. The semiconductor device as set forth in claim 1 , wherein a solder resist is provided on said first electronic component, and said flow-inducing section is formed as a protruding portion in said solder resist.
6. The semiconductor device as set forth in claim 1 , wherein said flow-inducing section has a two-dimensional geometry, in which a concave portion is included in a side of said second electronic component.
7. The semiconductor device as set forth in claim 1 , wherein said flow-inducing section is provided so as to surround a spot where a supply of said underfill resin is started, from a side opposite to said second electronic component.
8. The semiconductor device as set forth in claim 1 , wherein said flow-inducing section is provided in vicinity of a corner of said second electronic component.
9. A method for manufacturing the semiconductor device as set forth in claim 1 , comprising:
mounting a second electronic component on a first electronic component; and
supplying said underfill resin from a spot between said second electronic component and said inflow inducing section to fill a gap between said first and said second electronic components with the underfill resin,
wherein said inflow inducing section has a two-dimensional geometry that is equivalent to a portion of a circle or a rectangle, and wherein an open-circuit of said flow-inducing section is oriented toward said second electronic component.
10. A semiconductor device, comprising:
a first electronic component;
a second electronic component mounted on said first electronic component;
an underfill resin provided in a gap between said first and said second electronic components; and
a flow-inducing section provided in vicinity of said second electronic component on said first electronic component, said flow-inducing section being capable of inducing a flow of said underfill resin into said gap, wherein said flow-inducing section has a two-dimensional geometry that is equivalent to a portion of a rectangle, and wherein an open-circuit of said flow-inducing section is oriented toward said second electronic component.
11. The semiconductor device as set forth in claim 10 , wherein said portion of said rectangle is two sides of said rectangle.
12. The semiconductor device as set forth in claim 10 , wherein said portion of said rectangle is three sides of said rectangle.