Semiconductor device and method of manufacturing the same
View Patent ↗Aimed at improving adhesiveness between upper and lower interconnects in semiconductor devices, a semiconductor device of the present invention includes a second dielectric multi-layered film formed on a substrate, and containing a lower interconnect; a first dielectric multi-layered film formed on the second dielectric multi-layered film, and having a recess; an MOx film formed on the inner wall of the recess, and containing a metal M and oxygen as major components; an M film formed on the MOx film, and containing the M as a major component; and an electric conductor formed on the M film so as to fill the recess, and containing Cu as a major component, wherein the surficial portion of the interconnect fallen straight under the bottom of the recess has an oxygen concentration of 1% or smaller.
1. A semiconductor device comprising:
a second dielectric multilayered film formed on a substrate, and containing an interconnect;
a first dielectric multilayered film formed on said second dielectric multilayered film, and having a recess,
an MOx film formed on the inner wall of said recess, and containing a metal M and oxygen as major components;
an M film formed on said MOx film in said recess, and containing said M as a major component; and
an electric conductor formed on said M film in said recess so as to fill said recess, and containing Cu as a major component,
wherein the surficial portion of said interconnect fallen straight under the bottom of said recess has an oxygen concentration of 1% or smaller.
2. The semiconductor device as claimed in claim 1 ,
further comprising a dielectric film containing substantially no oxygen, formed between said first dielectric multilayered film and said MOx film.
3. The semiconductor device as claimed in claim 1 ,
wherein said M film is formed at the bottom of said recess.
4. The semiconductor device as claimed in claim 1 ,
wherein said M is Ru.