IP Library Granted Patent US 7,662,007
Granted Patent B2
US 7,662,007 · App. 11/907,086 · Granted Feb 16, 2010

Method of fabricating sealing substrate

Assignee: Seiko Epson Corporation
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Quick Facts
Patent No.
US 7,662,007
App. No.
11/907,086
Granted
Feb 16, 2010
Kind
B2
Abstract

A sealing substrate has first and second substrates. A hollow portion is formed in a first surface of the first substrate. The first substrate has a plate portion that forms a bottom surface of a hollow portion and a frame portion that forms an inner wall surface of the hollow portion. The second substrate is affixed to a second surface of the first substrate. The second substrate is formed of a material having a lower specific gravity than that of the first substrate.

Claims (12)

1. A method of fabricating a sealing member comprising:

attaching a second plate-shaped member to a first plate-shaped member through heating and pressing the second plate-shaped member in a direction of the first plate-shaped member, the second plate-shaped member being formed of a material having a specific gravity that is less than a specific gravity of the first plate-shaped member, the second plate-shaped member being a single-layer or multi-layer film sheet having a thermoplastic resin on a bonding surface; and

carving a hollow portion on the first plate-shaped member on an opposite side to a surface on which the second plate-shaped member is attached.

2. The method of fabricating a sealing member as defined in claim 1 , wherein a plurality of the hollow portions are formed in the first plate-shaped member, and further comprising cutting the first and second plate-shaped members corresponding to each of the hollow portions to obtain a plurality of substrates.

3. A method of fabricating a sealing member comprising:

providing molten resin on a first plate-shaped member to form a second plate-shaped member on the first plate-shaped member, the second plate-shaped member being formed of a material having a specific gravity that is less than a specific gravity of the first plate-shaped member; and

carving a hollow portion on the first plate-shaped member on an opposite side to a surface on which the second plate-shaped member is provided.

4. The method of fabricating a sealing member as defined in claim 3 , wherein a plurality of the hollow portions are formed in the first plate-shaped member, and further comprising cutting the first and second plate-shaped members corresponding to each of the hollow portions to obtain a plurality of substrates.

5. A method of fabricating a sealing member comprising:

attaching a second plate-shaped member to a first plate-shaped member, the second plate-shaped member being formed of a material having a specific gravity that is less than a specific gravity of the first plate-shaped member;

carving hollow portions on the first plate-shaped member on an opposite side to a surface on which the second plate-shaped member is attached; and

cutting the first and second plate-shaped members corresponding to each of the hollow portions to obtain a plurality of substrates.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 30, 2013
From: SEIKO EPSON CORPORATION
To: INTELLECTUAL KEYSTONE TECHNOLOGY LLC
Reel/Frame 030321/0296 →
Priority Claims (1)
JP 2002-12884 · Jan 22, 2002 · national
Continuity (3)
Continuation 1136587700 · Mar 2, 2006
Continuation 1034726200 · Jan 21, 2003
Related Publication 20080045111A1 · Feb 21, 2008