IP Library Granted Patent US 8,177,911
Granted Patent B2
US 8,177,911 · App. 11/907,322 · Granted May 15, 2012

Damage evaluation method of compound semiconductor member, production method of compound semiconductor member, gallium nitride compound semiconductor member and gallium nitride compound semiconductor membrane

Assignee: Sumitomo Electric Industries, Ltd.
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Quick Facts
Patent No.
US 8,177,911
App. No.
11/907,322
Granted
May 15, 2012
Kind
B2
Abstract

A method of evaluating damage of a compound semiconductor member, comprising: a step of performing measurement of photoluminescence on a surface of the compound semiconductor member; and a step of evaluating damage on the surface of the compound semiconductor member, using a half width of a peak at a wavelength corresponding to a bandgap of the compound semiconductor member, in an emission spectrum obtained by the measurement of photoluminescence.

Claims (11)

1. A gallium nitride substrate on which a device is to be formed, wherein:

the gallium nitride substrate has a gallium nitride (GaN) bandgap,

the gallium nitride substrate has a front surface,

the front surface has a surface damage such a level that, when a laser light having a wavelength shorter than a wavelength corresponding to the GaN bandgap is irradiated to the front surface of the gallium nitride substrate, a photoluminescence emission PL 1 having a wavelength corresponding to the GaN bandgap and a photoluminescence emission PL 2 having a wavelength between 470 nm to 640 nm are obtained, and an intensity of the PL 1 is not less than twice an intensity of the PL 2 .

2. The gallium nitride substrate according to claim 1 , wherein the gallium nitride substrate includes a base substrate on which the gallium nitride substrate is disposed.

3. A gallium nitride compound semiconductor membrane formed on the gallium nitride substrate according to claim 1 .

4. The gallium nitride substrate according to claim 1 , wherein a wavelength of a peak of the PL 1 exists near 365 nm.

5. The gallium nitride substrate according to claim 1 , wherein the damage is caused by a polishing or etching process.

6. A compound semiconductor substrate comprising:

the gallium nitride substrate according to claim 1 ; and

an epitaxial layer formed on the front surface of the gallium nitride substrate.

Assignments (1)
NUNC PRO TUNC ASSIGNMENT Recorded Dec 7, 2023
From: SUMITOMO ELECTRIC INDUSTRIES, LTD.
To: MITSUBISHI CHEMICAL CORPORATION
Reel/Frame 065817/0967 →
Priority Claims (1)
JP P2005-165957 · Jun 6, 2005 · national
Continuity (2)
Division 11446976 · Jun 6, 2006
Related Publication 20080044338A1 · Feb 21, 2008