Adhesive composition

1. An adhesive composition comprising:

at least one phosphate group-containing monomer (a) having a fluorocarbon group represented by Chemical Formula 1; and

at least one solvent (b),

wherein R is a hydrogen atom or a methyl group, n, p and q are natural numbers, 2≦n≦10, p+q≦n and p+q+n≦13.

2. The adhesive composition according to claim 1 , further comprising at least one coupling agent (c).

3. The adhesive composition according to claim 1 , further comprising at least one polymerization initiator (d), at least one polymerization promoter (e), or a combination thereof.

4. The adhesive composition according to claim 1 , further comprising at least one filler (f).

5. The adhesive composition according to claim 1 , wherein said at least one phosphate group-containing monomer (a) is present in an amount of from 0.001 to 99 wt % based on the total weight of the composition.

6. The adhesive composition according to claim 1 , wherein said at least one phosphate group-containing monomer (a) is present in an amount of from 0.01 to 90 wt % based on the total weight of the composition.

7. The adhesive composition according to claim 1 , wherein said at least one phosphate group-containing monomer (a) is present in an amount of from 0.1 to 85 wt % based on the total weight of the composition.

8. The adhesive composition according to claim 1 , wherein said solvent (b) is a solvent having a boiling point of 150° C. or less at normal pressure.

9. The adhesive composition according to claim 1 , wherein said solvent (b) is a solvent having a boiling point of 110° C. or less at normal pressure.

10. The adhesive composition according to claim 1 , wherein said solvent (b) comprises at least one selected from the group consisting of water; ethanol; methanol; 1-propanol; isopropyl alcohol; acetone; methyl ethyl ketone; ethyl acetate; methyl acetate; ethyl propionate; methyl methacrylate; 1,2-dimethoxyethane; 1,2-di ethoxyethane; tetrahydrofuran; heptane; hexane; toluene; chloroform; and dichloromethane.

11. The adhesive composition according to claim 2 , wherein said coupling agent (c) comprises at least one selected from the group consisting of methyltrimethoxysilane; methyltriethoxysilane; methyltrichlorosilane; dimethyldichlorosilane; trimethylchlorosilane; vinyltrimethoxysilane; vinyltriethoxysilane; vinyltrichlorosilane; vinyltriacetoxysilane; vinyltri(β-methoxyethoxy)silane; 3-(meth)acryloyloxypropyltrimethoxysilane; 3-(meth)acryloyloxypropyltriethoxysilane; 6-(meth)acryloyloxyhexyltrimethoxysilane; 6-(meth)acryloyloxyhexyltriethoxysilane; 10-(meth)acryloyloxydecyltrimethoxysilane; 10-(meth)acryloyloxydecyltriethoxysilane; 11-(meth)acryloyloxyundecyltrimethoxysilane; 11-(meth)acryloyloxyundecyltriethoxysilane; 3-(meth)acryloyloxypropylpentamethyldisiloxane; 3-chloropropyltrimethoxysilane; mercaptopropyltrimethoxysilane; hexamethyldisilazane; isopropyl triisostearoyl titanate; isopropyl trioctanoyl titanate; isopropyl isostearoyl diacryl titanate; isopropyl tridecyl benzene sulfonyl titanate; isopropyl dimethacryloyl isostearoyl titanate; isopropyl tricumyl phenyl titanate; and acetoalkoxy aluminum diisopropylate.

12. The adhesive composition according to claim 3 , wherein said at least one polymerization initiator (d) is present in an amount of from 0.01 to 10 wt %, based on the total weight of the composition.

13. The adhesive composition according to claim 3 , wherein said at least one polymerization initiator (d) is present in an amount of from 0.1 to 5 wt %, based on the total weight of the composition.

14. The adhesive composition according to claim 3 , wherein said at least one polymerization initiator (d) comprises at least one member selected from the group consisting of an α-diketone, a ketal, a thioxanthone, an acylphosphine oxide, a coumarin, a halomethyl-s-triazine, and an organic peroxide.

15. The adhesive composition according to claim 3 , wherein said at least one polymerization promoter (e) comprises at least one member selected from the group consisting of a tertiary amine, an aldehyde, a compound having a thiol group, sulfinic acid, and a salt of a sulfinic acid.

16. The adhesive composition according to claim 3 , wherein said at least one polymerization promoter (e) is present in an amount of from 0.01 to 10 wt %, based on the total weight of the composition.

17. The adhesive composition according to claim 3 , wherein said at least one polymerization promoter (e) is present in an amount of from 0.05 to 7 wt %, based on the total weight of the composition.

18. The adhesive composition according to claim 3 , wherein said at least one polymerization promoter (e) is present in an amount of from 0.1 to 5 wt %, based on the total weight of the composition.