COMPOSITION FOR FORMATION OF MOLD
Disclosed is a composition for formation of a mold, which is used in a method for producing a nanostructure by removing a portion of a thin film formed on the surface of a mold, and removing the mold, the composition including an organic compound, which has a hydrophilic group and has a molecular weight of 500 or more.
1 . A composition for formation of a mold, which is used in a method for producing a nanostructure by removing a portion of a thin film formed on the surface of a mold and removing the mold,
the composition comprising an organic compound, which has a hydrophilic group and has a molecular weight of 500 or more.
2 . A composition for formation of a mold, which is used in a method for producing a nanostructure by removing a portion of a thin film formed on the surface of a mold, thereby exposing a portion of the mold, and removing the mold,
the composition comprising an organic compound, which has a hydrophilic group and has a molecular weight of 500 or more.
3 . A composition for formation of a mold, which is used in a method for producing a nanostructure by removing the top face of a thin film formed on the surface of a rectangular mold and removing the mold, thereby leaving only a thin film formed on the side face of the mold,
the composition comprising an organic compound, which has a hydrophilic group and has a molecular weight of 500 or more.
4 . A composition for formation of a mold according to claim 1 , wherein the thin film is at least one kind selected from the group consisting of a metal oxide, an organic/metal oxide composite, an organic compound, and an organic/inorganic composite.
5 . A composition for formation of a mold according to claim 2 , wherein the thin film is at least one kind selected from the group consisting of a metal oxide, an organic/metal oxide composite, an organic compound, and an organic/inorganic composite.
6 . A composition for formation of a mold according to claim 3 , wherein the thin film is at least one kind selected from the group consisting of a metal oxide, an organic/metal oxide composite, an organic compound, and an organic/inorganic composite.
7 . A composition for formation of a mold according to claim 4 , wherein the thin film is made of silica.
8 . A composition for formation of a mold according to claim 5 , wherein the thin film is made of silica.
9 . A composition for formation of a mold according to claim 6 , wherein the thin film is made of silica.
10 . A composition for formation of a mold according to claim 1 , wherein the hydrophilic group is at least one kind selected from the group consisting of a hydroxyl group, a carboxy group, a carbonyl group, an ester group, an amino group, and an amide group.
11 . A composition for formation of a mold according to claim 2 , wherein the hydrophilic group is at least one kind selected from the group consisting of a hydroxyl group, a carboxy group, a carbonyl group, an ester group, an amino group, and an amide group.
12 . A composition for formation of a mold according to claim 3 , wherein the hydrophilic group is at least one kind elected from the group consisting of a hydroxyl group, a carboxy group, a carbonyl group, an ester group, an amino group, and an amide group.
13 . A composition for formation of a mold according to claim 10 , wherein the hydrophilic group is a phenolic hydroxyl group.
14 . A composition for formation of a mold according to claim 11 , wherein the hydrophilic group is a phenolic hydroxyl group.
15 . A composition for formation of a mold according to claim 12 , wherein the hydrophilic group is a phenolic hydroxyl group.
16 . A composition for formation of a mold according to claim 1 , wherein the method of removing the mold is at least one kind selected from among plasma, ozone oxidization, elution, and firing.
17 . A composition for formation of a mold according to claim 2 , wherein the method of removing the mold is at least one kind selected from among plasma, ozone oxidization, elution, and firing.
18 . A composition for formation of a mold according to claim 3 , wherein the method of removing the mold is at least one kind selected from among plasma, ozone oxidization, elution, and firing.
19 . A composition for formation of a mold according to claim 1 , wherein the organic compound, which is contained in the composition for formation of a mold, is an organic compound which has a molecular weight of more than 2,000 and has 0.2 equivalents or more of a hydrophilic group.
20 . A composition for formation of a mold according to claim 2 , wherein the organic compound, which is contained in the composition for formation of a mold, is an organic compound which has a molecular weight of more than 2,000 and has 0.2 equivalents or more of a hydrophilic group.
21 . A composition for formation of a mold according to claim 3 , wherein the organic compound, which is contained in the composition for formation of a mold, is an organic compound which has a molecular weight of more than 2,000 and has 0.2 equivalents or more of a hydrophilic group.
22 . A composition for formation of a mold according to claim 1 , which is sensitive to radiation.
23 . A composition for formation of a mold according to claim 2 , which is sensitive to radiation.
24 . A composition for formation of a mold according to claim 3 , which is sensitive to radiation.
25 . A composition for formation of a mold according to claim 1 , wherein the organic compound contained in the composition for formation of a mold is a compound having, in addition to a hydrophilic group, an acid dissociable, dissolution inhibiting group, and the composition for formation of a mold further contains an acid generator.
26 . A composition for formation of a mold according to claim 2 , wherein the organic compound contained in the composition for formation of a mold is a compound having, in addition to a hydrophilic group, an acid dissociable, dissolution inhibiting group, and the composition for formation of a mold further contains an acid generator.
27 . A composition for formation of a mold according to claim 3 , wherein the organic compound contained in the composition for formation of a mold is a compound having, in addition to a hydrophilic group, an acid dissociable, dissolution inhibiting group, and the composition for formation of a mold further contains an acid generator.
28 . A composition for formation of a mold according to claim 25 , wherein the organic compound contained in the composition for formation of a mold is a resin having a weight average molecular weight within a range from more than 2,000 to 30,000, comprising a unit having a hydrophilic group and a unit having an acid dissociable, dissolution inhibiting group, and the amount of the unit having a hydrophilic group is 50 mol % or more.
29 . A composition for formation of a mold according to claim 26 , wherein the organic compound contained in the composition for formation of a mold is a resin having a weight average molecular weight within a range from more than 2,000 to 30,000, comprising a unit having a hydrophilic group and a unit having an acid dissociable, dissolution inhibiting group, and the amount of the unit having a hydrophilic group is 50 mol % or more.
30 . A composition for formation of a mold according to claim 27 , wherein the organic compound contained in the composition for formation of a mold is a resin having a weight average molecular weight within a range from more than 2,000 to 30,000, comprising a unit having a hydrophilic group and a unit having an acid dissociable, dissolution inhibiting group, and the amount of the unit having a hydrophilic group is 50 mol % or more.
31 . A composition for formation of a mold according to claim 28 , wherein the unit having a hydrophilic group is a unit derived from hydroxystyrene.
32 . A composition for formation of a mold according to claim 29 , wherein the unit having a hydrophilic group is a unit derived from hydroxystyrene.
33 . A composition for formation of a mold according to claim 30 , wherein the unit having a hydrophilic group is a unit derived from hydroxystyrene.