IP Library Granted Patent US 8,008,644
Granted Patent B2
US 8,008,644 · App. 11/914,645 · Granted Aug 30, 2011

Phase-change memory cell having two insulated regions

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Quick Facts
Patent No.
US 8,008,644
App. No.
11/914,645
Granted
Aug 30, 2011
Kind
B2
Abstract

A phase-change-memory cell is provided which comprises two insulated regions formed in a first phase-change material connected by a region formed in a second phase-change material. The crystallization temperature of the second phase-change material is below the crystallization temperature of the first phase-change material. By locally changing the material properties using a second PCM material, which switches phase at a lower temperature, a localized “hot spot” is obtained.

Claims (18)

1. A phase-change-memory cell comprising two insulated regions formed in a first phase-change material connected by a region formed in a second phase-change material whereby a crystallization temperature of the second phase-change material is below a crystallization temperature of the first phase-change material.

2. The memory cell of claim 1 whereby a cross-sectional area of the connecting region is less than a cross-sectional area of the insulated regions whereby a cross-section of each region is taken in a direction perpendicular to the direction defined by the insulated regions.

3. The memory cell of claim 2 whereby a width of the cross-sectional area of the connecting region is less a width of the cross-sectional area of the insulated regions.

4. The memory cell of claim 2 whereby a height of the cross-sectional area of the connecting region is less than a height of the cross-sectional area of the insulated regions.

5. A method for forming a phase-change-memory cell according to claim 1 comprising:

forming two insulated regions in a first phase-change material; and

forming a region in a second phase-change material connecting the two insulated regions.

6. The method of claim 5 wherein the step of forming two insulated regions comprises:

forming a layer of the first phase-change material on a substrate; and,

patterning this layer to form the two insulated regions.

7. The method of claim 6 , wherein the step of patterning comprises:

a first patterning step to form a region in the first phase-change material; and,

a second patterning step separating this region into two insulated regions.

8. The method of claim 6 , wherein the step of forming the connecting region comprises:

forming a layer of the second phase-change material over the patterned layer of the first phase-change material; and,

patterning this second layer to form a region connecting the two insulated regions.

9. The method of claim 8 , wherein the second layer is patterned using a mask.

10. The method of claim 8 , wherein the second layer is patterned such that the width of the cross-sectional area of the connecting region is less than the width of the cross-sectional area of the insulated regions.

Assignments (11)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2017
From: GOUX, LUDOVIC; WOUTERS, DIRK; LISONI, JUDITH; GILE, THOMAS
To: NXP B.V.; INTERUNIVERSITAIR MICROELEKTRONICA CENTRUM VZW
Reel/Frame 043359/0802 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 13, 2009
From: KONINKLIJKE PHILIPS ELECTRONICS N.V.
To: NXP B.V.
Reel/Frame 022092/0572 →