IP Library Granted Patent US 9,153,765
Granted Patent B2
US 9,153,765 · App. 11/916,725 · Granted Oct 6, 2015

Piezoelectric multilayer component

Inventors: Heinz Florian (Bad Gams, AT); Michael Hirschler (Graz, AT); Helmut Sommariva (Graz, AT)
Assignee: EPCOS AG
H01L41/0838
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,153,765
App. No.
11/916,725
Granted
Oct 6, 2015
Kind
B2
Abstract

The invention relates to a piezoelectric multi-layer component with a plurality of piezoelectric layers ( 1 ) lying one above the other and with electrode layers ( 2 a, 2 b ) arranged between the piezoelectric layers, wherein an absorption layer ( 4 ) of absorbing mechanical vibration energy is arranged in the layer stack.

Claims (37)

1. A piezoelectric multi-layer component comprising a stack of layers, the stack of layers comprising:

piezoelectric layers;

electrode layers, the electrode layers being among the piezoelectric layers; and

an absorption layer to produce an interface effect for a pressure wave or a vibration pulse that affects the piezoelectric multi-layer component, the absorption layer being among piezoelectric and electrode layers in the stack;

wherein the piezoelectric layers, the electrode layers, and the absorption layer together form a sintered monolithic component; and

wherein the absorption layer is thicker than individual piezoelectric layers.

2. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer is configured to produce at least one of the following effects on the vibration pulse or on the pressure wave: absorption, refraction, destruction, and deflection.

3. The piezoelectric multi-layer component of claim 1 , wherein the pressure wave or the vibration pulse is generated via impact, shock, sound, or vibration energy.

4. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer comprises a ceramic layer.

5. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer comprises a piezoelectric layer.

6. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer has a lower density than ones of the piezoelectric layers in the stack that are adjacent to the absorption layer.

7. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer comprises compressible regions comprised of solid or gaseous components.

8. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer has a higher porosity than ones of the piezoelectric layers in the stack that are adjacent to the absorption layer.

9. The piezoelectric multi-layer component of claim 1 , wherein piezoelectric layers in the stack are sintered with each other.

10. The piezoelectric multi-layer component of claim 1 , wherein the stack comprises additional absorption layers.

11. The piezoelectric multi-layer component of claim 10 , wherein absorption layers in the stack are uniformly distributed over a height of the stack.

12. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer comprises an inorganic material and piezoelectric ceramic.

13. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer comprises an inorganic material that makes the absorption layer compressible and that causes an interface effect for a pressure wave as a result of distribution of the inorganic material.

14. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer comprises an inorganic material, the inorganic material comprising: a gas, a distributed crystalline, or an amorphous solid body.

15. The piezoelectric multi-layer of claim 1 , wherein the absorption layer comprises a metal or a ceramic.

16. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer comprises an inorganic substance.

17. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer comprises an adhesive or a duroplastic.

18. The piezoelectric multi-layer of claim 1 , wherein electrode layers adjacent to the absorption layer are at a same electric potential.

19. The piezoelectric multi-layer component of claim 1 , wherein a porosity of the absorption layer is 1.2 to 3 times a porosity of the piezoelectric layers in the stack.

20. The piezoelectric multi-layer component of claim 1 , wherein the absorption layer comprises a same ceramic substance as the piezoelectric layers in the stack.

21. The piezoelectric multi-layer component of claim 10 , wherein absorption layers in the stack have higher elasticity than ones of the piezoelectric layers in the stack that are adjacent to the absorption layers.

22. The piezoelectric multi-layer component of claim 10 , wherein absorption layers in the stack have higher compressibility relative to ones of the piezoelectric layers in the stack that are adjacent to the absorption layers.

23. The piezoelectric multi-layer component of claim 10 , wherein absorption layers in the stack are configured to reduce stiffness in the piezoelectric multi-layer component.

24. The piezoelectric multi-layer component of claim 10 , wherein absorption layers in the stack are configured so as not to crack during operation of the piezoelectric multi-layer component.

25. The piezoelectric multi-layer component of claim 1 , which is configured so that, during operation of the piezoelectric multi-layer component, a crack produced in the absorption layer has a traced length that is longer than a length of the absorption layer.

26. The piezoelectric multi-layer component of claim 10 , wherein the absorption layers comprise a material that is different from a base substance of the piezoelectric layers.

27. A method for use with a piezoelectric multi-layer component comprising a stack of layers, the stack of layers comprising piezoelectric layers, electrode layers, and absorption layers, the method comprising:

using the absorption layers to absorb mechanical energy in the piezoelectric multi-layer component through scattering, deflection, or damping;

wherein the electrode layers are among the piezoelectric layers;

wherein the absorption layers are among piezoelectric and electrode layers in the stack;

wherein the piezoelectric layers, the electrode layers, and the absorption layers together form a sintered monolithic component; and

wherein an absorption layer is thicker than individual piezoelectric layers.

Assignments (2)
CHANGE OF NAME Recorded Oct 26, 2022
From: EPCOS AG
To: TDK ELECTRONICS AG
Reel/Frame 061774/0102 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2008
From: FLORIAN, HEINZ; HIRSCHLER, MICHAEL; SOMMARIVA, HELMUT
To: EPCOS AG
Reel/Frame 021515/0847 →
Priority Claims (1)
DE 10 2005 026 717 · Jun 9, 2005 · national
Continuity (1)
Related Publication 20090278422A1 · Nov 12, 2009