IP Library Granted Patent US 9,318,685
Granted Patent B2
US 9,318,685 · App. 11/921,722 · Granted Apr 19, 2016

Method for producing a superconductive element

Inventor: Jukka Somerkoski (Ulvila, FI)
Assignee: Luvata Espoo Oy
H01L39/2403H01L39/14
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Quick Facts
Patent No.
US 9,318,685
App. No.
11/921,722
Granted
Apr 19, 2016
Kind
B2
Abstract

The invention relates to a method for producing a superconductive element to be used as a wire-in-channel superconductor in magnetic resonance imaging (MRI) and in nuclear magnetic resonance (NMR) applications, which superconductive element contains a superconductive wire and a copper component having a longitudinal groove and the superconductive wire being positioned in the groove. In order to produce the wire-in-channel superconductive element by a mechanical contact between the superconductive wire and a wall of the groove in the copper component, at least one contact surface is coated with a lead free solder material before having the mechanical contact. In order to enhance the thermal and electrical conduction and to create a bond between the said components the soldering material is fused in annealing process step.

Claims (26)

1. Method for producing a superconductive element to be used as a wire-in-channel superconductor in magnetic resonance imaging (MRI) and in nuclear magnetic resonance (NMR) applications, comprising the steps of:

providing a superconductive wire and a copper component having a longitudinal groove;

positioning the superconductive wire in the groove;

creating mechanical contact with at least one contact surface between the superconductive wire and a wall of the groove in the copper component;

deforming to produce an intimate contact between the at least one contact surface;

annealing the deformed superconductive wire and copper component at a temperature higher than the solidus temperature of a lead free solder material to achieve a metallic or intermetallic interface between the wire and the wall or the walls of the groove;

wherein the at least one contact surface is coated with the lead free solder material before having the mechanical contact;

wherein the lead free solder material is in contact with the superconductive wire;

wherein the lead free solder material is a tin based alloy;

wherein the tin based alloy is a binary alloy of tin-bismuth in which the bismuth content is 20 to 60% by weight; and

wherein the binary alloy of tin-bismuth is alloyed with one or two components from the group of copper, silver, zinc, antimony and indium so that the content of each alloyed component is 0.1 to 20% by weight and the rest being tin or tin and impurities.

2. Method according to the claim 1 , wherein the superconductive wire is coated with the lead free solder material.

3. Method according to the claim 1 , wherein the wall of the groove in the copper component is coated with the lead free solder material.

4. Method according to the claim 1 , wherein the superconductive wire and the wall of the groove in the copper component are coated with the lead free solder material.

5. Method according to claim 1 , wherein the contact surface is coated using electroplating techniques.

6. Method according to claim 1 , wherein the at least one contact surface is coated using hot tinning techniques.

7. Method according to claim 1 , wherein the at least one contact surface is coated using chemical vapour deposition techniques.

8. Method according to claim 1 , wherein the at least one contact surface is coated using physical vapour deposition techniques.

9. Method according to the claim 1 , wherein the annealing is carried out by batch annealing.

10. Method according to the claim 1 , wherein the annealing is carried out by forced flow convection tube annealing.

11. Method according to the claim 1 , wherein the annealing is carried out by strand annealing.

12. Method according to the claim 1 , wherein the annealing is carried out by inductive annealing.

13. Method according to the claim 1 , wherein the annealing is carried out by resistive annealing.

14. Method according to the claim 1 , wherein the content of each alloyed component is 0.1 to 5% by weight.

15. A superconductive element to be used as a wire-in-channel superconductor in magnetic resonance imaging (MRI) and in nuclear magnetic resonance (NMR) applications produced using the method according to claim 1 .

16. The superconductive element of claim 15 , wherein the content of each alloyed component is 0.1 to 5% by weight.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 28, 2017
From: LUVATA ESPOO OY
To: MMC COPPER PRODUCTS OY
Reel/Frame 043726/0652 →
CHANGE OF NAME Recorded Feb 25, 2016
From: LUVATA OY
To: LUVATA ESPOO OY
Reel/Frame 037975/0081 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 5, 2008
From: SOMERKOSKI, JUKKA
To: LUVATA OY
Reel/Frame 021341/0073 →
Priority Claims (1)
FI 20050509 · May 13, 2005 · national
Continuity (1)
Related Publication 20080318793A1 · Dec 25, 2008