IP Library Patent Application 11928597
Patent Application
App. No. 11/928,597

THIN FILM MAGNETIC HEAD FOR DETECTING LEAK MAGNETIC FIELD FROM RECORDING MEDIUM BY USING TUNNEL MAGNETORESISTIVE EFFECT

Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US None
App. No.
11/928,597
Abstract

A thin film magnetic head includes: an element part formed by laminating an antiferromagnetic layer, a fixed magnetic layer, an insulating barrier layer, and a free magnetic layer on a substrate; and a protective layer that protects an end surface of the element part opposite a recording medium. The insulating barrier layer is formed using an AlOx film or an MgO film. An adhesive layer is provided between the protective layer and the end surface of the element part on which the insulating barrier layer is exposed, a nitride existing on at least an interface between the adhesive layer and the insulating barrier layer

Claims (17)

1 . A thin film magnetic head comprising:

an element part including a laminated substrate of an antiferromagnetic layer, a fixed magnetic layer, an insulating barrier layer, and a free magnetic layer; and

a protective layer that protects an end surface of the element part opposite a recording medium,

wherein the insulating barrier layer is formed using an AlOx film or an MgO film, and

an adhesive layer is provided between the protective layer and the end surface of the element part on which the insulating barrier layer is exposed, a nitride existing on at least an interface between the adhesive layer and the insulating barrier layer.

2 . The thin film magnetic head according to claim 1 ,

wherein the end surface of the element part is a nitrided surface subjected to a nitriding treatment, and

the adhesive layer made of Si is formed on the nitrided surface.

3 . The thin film magnetic head according to claim 1 ,

wherein the adhesive layer is comprises a single layered structure including an Si-based nitride layer.

4 . The thin film magnetic head according to claim 1 ,

wherein the end surface of the element part is a nitrided surface subjected to a nitriding treatment, and

the adhesive layer is formed in a structure where an Si-based nitride layer and an Si layer are sequentially laminated on the nitrided surface.

5 . The thin film magnetic head according to claim 3 ,

wherein the Si-based nitride layer is formed of Si 3 N 4 , SiN, or SiON.

6 . The thin film magnetic head according to claim 1 ,

wherein the protective layer is formed using a diamond-like carbon film.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 22, 2008
From: ALPS ELECTRIC CO., LTD.
To: TDK CORPORATION
Reel/Frame 020394/0939 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2007
From: TONDOKORO, ATSUSHI; TAKAHASHI, TAKAHISA
To: ALPS ELECTRIC CO., LTD.
Reel/Frame 020038/0095 →