INVERTED THROUGH CIRCUIT BOARD MOUNTING WITH HEAT SINK
The apparatus contains a printed circuit board in which a heat sink is mounted adjacent to one side of the printed circuit board in contact with a heat generating device mounted to the circuit board and positioned at least in part within an aperture in the circuit board.
1 . An electronic device mounting arrangement, comprising:
a printed circuit board having one side and an other side;
a heat sink located adjacent to one side of the printed circuit board; and
at least one heat generating device positioned at least partially within an aperture formed in the printed circuit board and in thermal contact with the heat sink.
2 . The electronic device mounting arrangement of claim 1 , wherein the heat sink is mechanically attached to the printed circuit board.
3 . The electronic device mounting arrangement of claim 2 , wherein the heat sink is mechanically attached with metal fasteners mounted through the one side of the printed circuit board to the other side of the printed circuit board.
4 . The electronic device mounting arrangement of claim 1 , wherein the heat sink is adhesively attached to the printed circuit board.
5 . The electronic device mounting arrangement of claim 1 , wherein the heat sink is adhesively attached to the device.
6 . The electronic device mounting arrangement of claim 1 , wherein the heat sink comprises a multi-fin heat sink.
7 . The electronic device mounting arrangement of claim 1 , wherein the at least one heat generating device is mounted in an inverted orientation to the board.
8 . The electronic device mounting arrangement of claim 1 , wherein the heat generating device is soldered to the printed circuit board.
9 . The electronic device mounting arrangement of claim 1 , wherein the heat generating device is mounted to the circuit board so that an exposed surface of the heat generating device is essentially flush with the one side of the circuit board.
10 . The electronic device mounting arrangement of claim 1 , wherein the heat generating device is an integrated circuit.
11 . The electronic device mounting arrangement of claim 1 , wherein the heat generating device is a power module.
12 . A method of mounting a heat generating device to a circuit board which comprises providing a circuit board having one side and an other side with an aperture formed through the board of size sufficient to accommodate the heat generating device;
positioning the heat generating device at least partially within the aperture and mounting the heat generating device to the board; and
locating a heat sink adjacent to one side of the circuit board in thermal contact with the heat generating device.
13 . The method of claim 12 , wherein the heat generating device is soldered to the circuit board.
14 . The method of claim 12 , wherein the heat sink is mounted to the circuit board by mechanical fasteners.
15 . The method of claim 12 , wherein the heat sink is adhesively mounted to the board.
16 . The method of claim 12 , wherein the heat sink is adhesively mounted to the device.
17 . The method of claim 12 , including the step of positioning the heat generating device so that an exposed surface of the heat generating device is essentially flush with the one side of the circuit board.
18 . The method of claim 12 , wherein the heat generating device is an integrated circuit.
19 . The method of claim 12 , wherein the heat generating device is a power module.
20 . A printed circuit board assembly having a first side and a second side, and an integrated circuit positioned at least partially within an aperture formed in the printed circuit board, and mounted to the printed circuit board by gull-wing shaped leads.
21 . The printed circuit board assembly of claim 20 , wherein the integrated circuit is mounted in an inverted orientation to the board.
22 . The circuit board assembly according to claim 20 , wherein the integrated circuit is a heat generating device.
23 . The printed circuit board assembly of claim 20 , wherein the integrated circuit is mounted to the circuit board so that an exposed surface of the integrated circuit is essentially flush with a surface of the circuit board.