IP Library Granted Patent US 7,511,318
Granted Patent B2
US 7,511,318 · App. 11/942,056 · Granted Mar 31, 2009

Electromechanical memory array using nanotube ribbons and method for making same

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,511,318
App. No.
11/942,056
Granted
Mar 31, 2009
Kind
B2
Abstract

Electromechanical circuits, such as memory cells, and methods for making same are disclosed. The circuits include a structure having electrically conductive traces and supports extending from a surface of the substrate, and nanotube ribbons suspended by the supports that cross the electrically conductive traces, wherein each ribbon comprises one or more nanotubes. The electro-mechanical circuit elements are made by providing a structure having electrically conductive traces and supports, in which the supports extend from a surface of the substrate. A layer of nanotubes is provided over the supports, and portions of the layer of nanotubes are selectively removed to form ribbons of nanotubes that cross the electrically conductive traces. Each ribbon includes one or more nanotubes.

Claims (15)

1. A structure, comprising:

a substrate having a surface, the substrate comprising patterned regions of conductor and patterned regions of insulator below the surface of the substrate; and

a nonwoven nanotube fabric of unaligned nanotubes disposed on the surface of the substrate, wherein the nonwoven nanotube fabric is parallel to the substrate.

2. The structure of claim 1 , wherein the nonwoven nanotube fabric is disposed over at least one of a patterned region of conductor and a patterned region of insulator.

3. The structure of claim 1 , wherein the nonwoven nanotube fabric is patterned.

4. The structure of claim 1 , wherein a subset of the patterned regions of conductor are buried under one or more other materials below the surface of the substrate.

5. The structure of claim 1 , further comprising patterned regions of conductor disposed over the nonwoven nanotube fabric.

6. The structure of claim 1 , farther comprising patterned regions of insulator disposed over the nonwoven nanotube fabric.

7. The structure of claim 1 , farther comprising patterned regions of semiconductor disposed over the nonwoven nanotube fabric.

8. The structure of claim 1 , wherein the nonwoven nanotube fabric comprises a monolayer of nanotubes.

9. The structure of claim 1 , wherein the substrate further comprises patterned regions of semiconductor below the surface of the substrate.

10. The structure of claim 1 , wherein the conductor comprises metal.

11. The structure of claim 1 , wherein the substrate comprises a semiconductor wafer, wherein at least a subset of the regions of patterned conductor comprise addressing lines, and wherein at least a subset of the regions of patterned insulator insulate the addressing lines from one another.

12. The structure of claim 3 , wherein the nonwoven nanotube fabric is patterned to form a plurality of discrete regions of nonwoven nanotube fabric.

13. The structure of claim 5 , wherein at least one region of conductor disposed over the nonwoven nanotube fabric is in contact with addressing circuitry.

Assignments (3)
RELEASE OF SECURITY INTEREST IN PATENTS Recorded Jul 8, 2021
From: SILICON VALLEY BANK
To: NANTERO, INC.
Reel/Frame 056790/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Nov 11, 2020
From: NANTERO, INC.
To: SILICON VALLEY BANK
Reel/Frame 054383/0632 →
LICENSE Recorded Aug 20, 2008
From: NANTERO, INC.
To: LOCKHEED MARTIN CORPORATION
Reel/Frame 021411/0337 →