IP Library Granted Patent US 7,817,248
Granted Patent B2
US 7,817,248 · App. 11/947,900 · Granted Oct 19, 2010

Optical imaging arrangement

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Quick Facts
Patent No.
US 7,817,248
App. No.
11/947,900
Granted
Oct 19, 2010
Kind
B2
Abstract

There is provided an optical imaging arrangement comprising: a mask unit comprising a pattern, a substrate unit comprising a substrate, an optical projection unit comprising a group of optical element units, the optical projection unit being adapted to transfer an image of the pattern onto the substrate, a first imaging arrangement component, the first imaging arrangement component being a component of one of the optical element units, a second imaging arrangement component, the second imaging arrangement component being different from the first imaging arrangement component and being a component of one of the mask unit, the optical projection unit and the substrate unit, and a metrology arrangement. The metrology arrangement captures a spatial relationship between the first imaging arrangement component and the second imaging arrangement component. The metrology arrangement comprises a reference element, the reference element being mechanically connected directly to the first imaging arrangement component.

Claims (58)

1. An optical imaging arrangement, comprising:

a mask unit adapted to receive a pattern,

a substrate unit adapted to receive a substrate;

an optical projection unit comprising optical element units, the optical projection unit being adapted to transfer an image of the pattern onto the substrate;

a first imaging arrangement component, the first imaging arrangement component being a component of the optical element units,

a second imaging arrangement component, the second imaging arrangement component being different from the first imaging arrangement component, the second imaging component being selected from the group consisting of a component of the mask unit, a component of the optical projection unit and a component of the substrate unit;

a metrology arrangement;

the metrology arrangement comprising at least one reference element;

the at least one reference element being mechanically connected directly to the first imaging arrangement component;

the metrology arrangement adapted to capture a spatial relationship between the first imaging arrangement component and the second imaging arrangement component in two translational degrees of freedom via the at least one reference element.

2. The optical imaging arrangement according to claim 1 , wherein

the first imaging arrangement component is a component of the optical element unit located closest to the substrate unit and

the second imaging arrangement component is the substrate unit.

3. The optical imaging arrangement according to claim 1 , wherein the first imaging arrangement component is a component of the optical element unit of the optical projection unit that is located closest to one of the mask unit and the substrate unit.

4. The optical imaging arrangement according to claim 1 , wherein the first imaging arrangement component is an optical element.

5. The optical imaging arrangement according to claim 1 , wherein the first imaging arrangement component is a mirror.

6. The optical imaging arrangement according to claim 1 , wherein the at least one reference element has a reference surface that comprises a surface selected from the group consisting of reflective surfaces and diffractive surfaces.

7. The optical imaging arrangement according to claim 6 , wherein the reference surface is a surface of the first imaging arrangement component.

8. The optical imaging arrangement according to claim 6 , wherein

the optical projection unit comprises a group of optical elements, the optical elements having projection surfaces cooperating in transferring the image of the pattern onto the substrate; and

the reference surface is selected from the group consisting of a projection surface and a surface of one of the optical elements that is not a projection surface.

9. The optical imaging arrangement according to claim 1 , wherein

the optical projection unit comprises a group of optical elements, the optical elements having projection surfaces cooperating in transferring the image of the pattern onto the substrate; and

the first imaging arrangement component is a mirror, the mirror having a front part with a reflective front surface and a rear part, the reflective front surface being one of the projection surfaces, and

at least a part of the at least one reference element is connected to the rear part.

10. The optical imaging arrangement according to claim 9 , wherein

the rear part comprises a rear surface opposite to the front surface,

the at least one reference element comprises a reference surface, the reference surface comprising a surface selected from the group consisting of a reflective surface and a diffractive surface, and

at least a part of the rear surface forms at least a part of the reference surface.

11. The optical imaging arrangement according to claim 1 , wherein

the optical projection unit consists of reflective optical elements having reflective projection surfaces cooperating in transferring the image of the pattern onto the substrate; and

the first imaging arrangement component is one of the reflective optical elements.

12. The optical imaging arrangement according to claim 1 , wherein the second imaging arrangement component is an optical element.

13. The optical imaging arrangement according to claim 1 , wherein

the optical projection unit comprises a first support structure supporting a sub-group of the optical element units, the sub-group excluding the first imaging arrangement component;

the first imaging arrangement component is supported via a vibration isolating device and a second support structure, the second support structure being different from the first support structure; and

the vibration isolating device has a first end and a second end, the first end directly contacting the second support structure the second end directly contacting one of the first support structure and a ground structure.

14. The optical imaging arrangement according to claim 13 , wherein the vibration isolating device has a resonant frequency between 0.01 Hz and 10 Hz.

15. The optical imaging arrangement according to claim 1 , wherein

the optical projection unit comprises a support structure supporting a sub-group of the optical element units, and

a vibration isolating device is provided, the vibration isolating device having a first end and a second end;

the first end of the vibration isolating device directly contacting the support structure, and

the second end of the vibration isolating device directly contacting a ground structure.

16. The optical imaging arrangement according to claim 1 , wherein

a control unit is provided;

the control unit being connected to the metrology arrangement to receive the spatial relationship between the first imaging arrangement component and the second imaging arrangement component;

the control unit adapted to control a position of at least one component of the optical imaging arrangement during a transfer of the image of the pattern onto the substrate as a function of the spatial relationship received from the metrology arrangement.

17. The optical imaging arrangement according to claim 1 , wherein the mask unit and the optical projection unit are adapted to use light in an EUV range.

18. An optical imaging arrangement comprising:

a mask unit adapted to receive a pattern,

a substrate unit adapted to receive a substrate;

an optical projection unit comprising a group of optical element units, the optical projection unit being adapted to transfer an image of the pattern onto the substrate;

a first imaging arrangement component, the first imaging arrangement component being a component of one of the optical element units,

a second imaging arrangement component, the second imaging arrangement component being a component of the mask unit;

a metrology arrangement;

the metrology arrangement comprising a reference element;

the at least one reference element being mechanically connected directly to the first imaging arrangement component;

the metrology arrangement capturing a spatial relationship between the first imaging arrangement component and the second imaging arrangement component using the reference element.

Assignments (2)
A MODIFYING CONVERSION Recorded Jan 18, 2011
From: CARL ZEISS SMT AG
To: CARL ZEISS SMT GMBH
Reel/Frame 025763/0367 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 22, 2008
From: KWAN, YIM-BUN PATRICK
To: CARL ZEISS SMT AG
Reel/Frame 020839/0682 →