IP Library Granted Patent US 7,871,759
Granted Patent B2
US 7,871,759 · App. 11/949,338 · Granted Jan 18, 2011

Barrier film material and pattern formation method using the same

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Quick Facts
Patent No.
US 7,871,759
App. No.
11/949,338
Granted
Jan 18, 2011
Kind
B2
Abstract

A resist film is formed on a substrate, and a barrier film including a compound whose alkali-insoluble property is changed to an alkali-soluble property through molecular structure change caused by an alkaline solution is formed on the resist film. Thereafter, with an immersion liquid provided on the barrier film, pattern exposure is performed by selectively irradiating the resist film through the barrier film with exposing light. After the pattern exposure, the barrier film is removed and the resist film is developed. Thus, a resist pattern made of the resist film is formed.

Claims (39)

1. A pattern formation method comprising the steps of:

forming a resist film on a substrate;

forming, on the resist film, a barrier film including a compound having a lactone structure;

performing pattern exposure by selectively irradiating the resist film through the barrier film with exposing light with a liquid provided on the barrier film;

removing the barrier film after the pattern exposure; and

forming a resist pattern made of the resist film by developing the resist film.

2. The pattern formation method of claim 1 ,

wherein the compound having a lactone structure and included in the barrier film is a polymer.

3. The pattern formation method of claim 1 ,

wherein the compound having a lactone structure is lactone.

4. The pattern formation method of claim 3 ,

wherein the lactone is γ-butyrolactone, δ-valerolactone, δ-pentalactone, ε-caprolactone or mevalonic lactone.

5. The pattern formation method of claim 1 ,

wherein the barrier film includes polyvinyl alcohol, polyacrylic acid or polyvinyl hexafluoroisopropyl alcohol.

6. The pattern formation method of claim 1 , further comprising a step of annealing the barrier film between the step of forming a barrier film and the step of performing pattern exposure.

7. The pattern formation method of claim 1 ,

wherein the liquid is water or an acidic solution.

8. The pattern formation method of claim 7 ,

wherein the acidic solution is a cesium sulfate aqueous solution or a phosphoric acid aqueous solution.

9. The pattern formation method of claim 1 ,

wherein the exposing light is ArF excimer laser, KrF excimer laser, Xe 2 laser, F 2 laser, KrAr laser or Ar 2 laser.

10. A pattern formation method comprising the steps of:

forming a resist film on a substrate;

forming, on the resist film, a barrier film including a compound having a lactone structure;

performing pattern exposure by selectively irradiating the resist film through the barrier film with exposing light with a liquid provided on the barrier film; and

removing the barrier film and forming a resist pattern made of the resist film by developing the resist film after the pattern exposure.

11. The pattern formation method of claim 10 ,

wherein the compound having a lactone structure and included in the barrier film is a polymer.

12. The pattern formation method of claim 10 ,

wherein the compound having a lactone structure is lactone.

13. The pattern formation method of claim 12 ,

wherein the lactone is γ-butyrolactone, δ-valerolactone, δ-pentalactone, ε-caprolactone or mevalonic lactone.

14. The pattern formation method of claim 10 ,

wherein the barrier film includes polyvinyl alcohol, polyacrylic acid or polyvinyl hexafluoroisopropyl alcohol.

15. The pattern formation method of claim 10 , further comprising a step of annealing the barrier film between the step of forming a barrier film and the step of performing pattern exposure.

16. The pattern formation method of claim 10 ,

wherein the liquid is water or an acidic solution.

17. The pattern formation method of claim 10 ,

wherein the exposing light is ArF excimer laser, KrF excimer laser, Xe 2 laser, F 2 laser, KrAr laser or Ar 2 laser.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Oct 26, 2020
From: JEFFERIES FINANCE LLC
To: RPX CORPORATION
Reel/Frame 054486/0422 →
SECURITY INTEREST Recorded Jun 29, 2018
From: RPX CORPORATION
To: JEFFERIES FINANCE LLC
Reel/Frame 046486/0433 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 5, 2013
From: PANASONIC CORPORATION
To: RPX CORPORATION
Reel/Frame 029756/0053 →
CHANGE OF NAME Recorded Nov 20, 2008
From: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
To: PANASONIC CORPORATION
Reel/Frame 021897/0516 →