Substrate processing method and substrate processing apparatus

1. A substrate processing method, comprising:

a cleaning processing step of cleaning a main surface of a substrate by supplying deionized water to the substrate;

a mixed organic solvent supplying step of supplying a fluid of a mixed organic solvent to the main surface of the substrate after the cleaning processing step, the fluid of the mixed organic solvent containing a fluid of a water-soluble organic solvent and a fluid of a fluorine organic solvent having a smaller surface tension than that of the deionized water and a lower water solubility than that of the fluid of the water-soluble organic solvent; and

a fluorine organic solvent supplying step of supplying the fluid of the fluorine organic solvent to the main surface of the substrate without supplying the fluid of the water-soluble organic solvent after the mixed organic solvent supplying step, wherein

the fluorine organic solvent supplying step includes a step of placing an opposing member having an opposing surface disposed such that the opposing surface is opposed to the main surface of the substrate, and a step of supplying a steam of the fluorine organic solvent to the main surface of the substrate by supplying the steam of the fluorine organic solvent between the main surface of the substrate and the opposing surface of the opposing member,

the method further comprising:

a step of setting, in parallel with the fluorine organic solvent supplying step, a temperature of the opposing surface of the opposing member above a dew point of the fluid of the fluorine organic solvent and setting a temperature on the main surface of the substrate to or below the dew point of the fluid of the fluorine organic solvent.

2. The substrate processing method according to claim 1 , wherein:

the fluid of the water-soluble organic solvent blends with the deionized water; and

the fluid of the fluorine organic solvent does not blend with the deionized water.

3. The substrate processing method according to claim 1 , wherein:

the mixed organic solvent supplying step includes a step of heating the fluid of the mixed organic solvent to be supplied to the main surface of the substrate.

4. The substrate processing method according to claim 1 , wherein:

the fluorine organic solvent supplying step includes a step of heating the fluid of the fluorine organic solvent to be supplied to the main surface of the substrate.

5. The substrate processing method according to claim 1 , wherein the water-soluble organic solvent includes at least one selected from a group consisting of methanol, ethanol, IPA (isopropyl alcohol), acetone, and trans-1,2-dichloroethylene.

6. The substrate processing method according to claim 1 , wherein the fluorine organic solvent includes HFE (hydrofluoroether).

7. A substrate processing method, comprising:

a cleaning processing step of cleaning a main surface of a substrate by supplying deionized water to the substrate;

a mixed organic solvent supplying step of supplying a fluid of a mixed organic solvent to the main surface of the substrate after the cleaning processing step, the fluid of the mixed organic solvent containing a fluid of a water-soluble organic solvent and a fluid of a fluorine organic solvent having a smaller surface tension than that of the deionized water and a lower water solubility than that of the fluid of the water-soluble organic solvent; and

a fluorine organic solvent supplying step of supplying the fluid of the fluorine organic solvent to the main surface of the substrate without supplying the fluid of the water-soluble organic solvent after the mixed organic solvent supplying step, wherein

the mixed organic solvent supplying step includes a step of placing an opposing member having an opposing surface disposed such that the opposing surface is opposed to the main surface of the substrate, and a step of supplying a steam of a mixed organic solvent containing a steam of the water-soluble organic solvent and a steam of the fluorine organic solvent to the main surface of the substrate by supplying the steam of the mixed organic solvent between the main surface of the substrate and the opposing surface of the opposing member,

the method further comprising:

a step of setting, in parallel with the mixed organic solvent supplying step, a temperature of the opposing surface of the opposing member above a dew point of the fluid of the mixed organic solvent and setting a temperature on the main surface of the substrate to or below the dew point of the fluid of the mixed organic solvent.

8. The substrate processing method according to claim 7 , wherein:

the fluid of the water-soluble organic solvent blends with the deionized water; and

the fluid of the fluorine organic solvent does not blend with the deionized water.

9. The substrate processing method according to claim 7 , wherein:

the mixed organic solvent supplying step includes a step of heating the fluid of the mixed organic solvent to be supplied to the main surface of the substrate.

10. The substrate processing method according to claim 7 , wherein:

the fluorine organic solvent supplying step includes a step of heating the fluid of the fluorine organic solvent to be supplied to the main surface of the substrate.

11. The substrate processing method according to claim 7 , wherein the water-soluble organic solvent includes at least one selected from a group consisting of methanol, ethanol, IPA (isopropyl alcohol), acetone, and trans-1,2-dichloroethylene.

12. The substrate processing method according to claim 7 , wherein the fluorine organic solvent includes HFE (hydrofluoroether).