Substrate processing apparatus and substrate processing method
View Patent ↗A part of the opening of the nozzle insertion hole located in the liquid discharging direction relative to the nozzle inserted in the nozzle insertion hole is enlarged in the liquid discharging direction. Therefore, the droplets which have migrated to the nozzle insertion hole adheres to the internal surface in the liquid discharging direction relative to the nozzle, that is, to the slanted part via the enlarged part. Moreover, the slanted part is provided slanted from the central portion of the nozzle insertion hole toward the enlarged part and separated away from the central portion of the substrate top surface. Hence, the adhering droplets flow in the liquid discharging direction along the slanted part to be discharged from the opening of the nozzle insertion hole.
1. A substrate processing apparatus, comprising:
a substrate holder which holds a substrate in a condition that a top surface of the substrate is directed toward above;
an opposed member which is disposed opposed against and separated away from the top surface of the substrate held by the substrate holder, and is provided with a nozzle insertion hole which has an opening on a substrate opposing surface facing the substrate top surface;
a nozzle which discharges, being inserted in the nozzle insertion hole, a processing liquid in a liquid discharging direction from the nozzle insertion hole toward a to rim portion of the substrate, supplies the processing liquid to the top rim portion, and accordingly performs a predetermined surface processing to the top rim portion; and
a guide portion which is provided in the nozzle insertion hole and guides droplets of the processing liquid adhering to the nozzle insertion hole in the vicinity of the opening in the liquid discharging direction;
wherein the guide portion includes an enlarged part and a slanted part, the enlarged part being a part of the opening which is formed enlarging the opening in the liquid discharging direction relative to the nozzle inserted in the nozzle insertion hole, the slanted part being a part of an internal surface of the nozzle insertion hole which is formed slanting from a center of the nozzle insertion hole in the liquid discharging direction relative to the nozzle toward the enlarged part and separating away from the center of the substrate top surface.
2. The substrate processing apparatus of claim 1 , wherein
the substrate opposing surface is approximately equal to or larger than the substrate top surface in a plan view and covers the entire substrate top surface, and
the enlarged part is extended in a radial direction of the substrate beyond the top rim portion of the substrate.
3. The substrate processing apparatus of claim 1 , further comprising a rotating unit which rotates the substrate held by the substrate holder.
4. A substrate processing apparatus, comprising:
a substrate holder which holds a substrate in a condition that a top surface of the substrate is directed toward above;
an opposed member which is disposed opposed against and separated away from the top surface of the substrate held by the substrate holder, and is provided with a nozzle insertion hole which has an opening on a substrate opposing surface facing the substrate top surface;
a nozzle which discharges, being inserted in the nozzle insertion hole, a processing liquid in a liquid discharging direction from the nozzle insertion hole toward a top rim portion of the substrate, supplies the processing liquid to the top rim portion, and accordingly performs a predetermined surface processing to the top rim portion; and
a guide portion which is provided in the nozzle insertion hole and guides droplets of the processing liquid adhering to the nozzle insertion hole in the vicinity of the opening in the liquid discharging direction;
wherein
the processing liquid discharged in the liquid discharging direction can migrate in a form of droplets from the top rim portion of the substrate toward the nozzle insertion hole, and
the guide portion includes a groove part which is provided in a part of the opening, is formed extending in a migrating direction of the droplets relative to the nozzle insertion hole in the vicinity of a part of the opening located in the liquid discharging direction relative to the nozzle which is inserted in the nozzle insertion hole.
5. The substrate processing apparatus of claim 4 , wherein
the substrate opposing surface is approximately equal to or larger than the substrate top surface in a plan view and covers the entire substrate top surface, and
the groove part is extended in a radial direction of the substrate beyond the top rim portion of the substrate.
6. The substrate processing apparatus of claim 4 , further comprising a rotating unit which rotates the substrate held by the substrate holder.