Method for manufacturing printed circuit board
A method for manufacturing a hollowed printed circuit board includes steps of: providing an electrically conductive layer; laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer; forming a protecting layer on the first surface of the electrically conductive layer in the first opening; creating an electrically conductive pattern in the conductive layer; removing the protecting layer; and laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, thereby a portion of the electrically conductive layer is exposed to exterior through the first through opening and the second through opening.
1. A method for manufacturing a printed circuit board, the method comprising steps of:
providing an electrically conductive layer;
laminating a first dielectric layer having a first through opening defined therein on a first surface of the electrically conductive layer;
forming a protecting layer on the first surface of the electrically conductive layer in the first opening;
creating an electrically conductive pattern in the conductive layer;
removing the protecting layer; and
laminating a second dielectric layer having a second through opening defined therein on an opposite second surface of the electrically conductive layer in a manner that the first through opening is aligned with the second through opening, and thereby a portion of the electrically conductive layer is exposed to the exterior through the first through opening and through the second through opening.
2. The method for manufacturing a printed circuit board as claimed in claim 1 , wherein a coating is formed in the first through opening and the coating is cured thereby forming the protective layer.
3. The method for manufacturing a printed circuit board as claimed in claim 2 , wherein the coating includes one of the solder resist and liquid photoresist.
4. The method for manufacturing a printed circuit board as claimed in claim 2 , wherein the coating is cured in an infrared ray oven.
5. The method for manufacturing a printed circuit board as claimed in claim 4 , wherein a temperature of the infrared ray oven is in a range from 90° Centigrade to 110° Centigrade.
6. The method for manufacturing a printed circuit board as claimed in claim 2 , wherein the coating is formed using a screen printing method.
7. The method for manufacturing a printed circuit board as claimed in claim 6 , wherein a 250-mesh screen template is used in the screen printing method.
8. The method for manufacturing a printed circuit board as claimed in claim 1 , wherein the conductive layer is cleaned using an acid solution prior to laminating the first dielectric layer on the conductive layer.
9. The method for manufacturing a printed circuit board as claimed in claim 1 , wherein the protective layer is removed using an alkali solution.
10. The method for manufacturing a printed circuit board as claimed in claim 9 , wherein the alkali solution is selected from the group consisting of sodium hydroxide solution and sodium carbonate solution.